DSEI2X30-12B

Diode Arrays Overview

The IXYS DSEI2X30-12B is a Fast Recovery Epitaxial Diode (FRED) featuring dual independent chips in an SOT-227B package. It supports a repetitive reverse voltage of 1200 V and a maximum average forward current of 28 A per diode at 50°C case temperature. The device exhibits a typical recovery time of 40 ns, with a maximum of 60 ns under specified test conditions. Forward voltage drop reaches 2.55 V at 30 A and 25°C junction temperature. Thermal resistance from junction to case is 1.25 K/W, and the component operates within a junction temperature range of -40°C to +150°C.

Diode Arrays Feature Summary

• Dual independent fast recovery epitaxial diodes integrated into a single miniBLOC package
• Soft recovery behavior with extremely low switching losses and low peak reverse recovery current
• High isolation voltage capability of 2500 Vrms between terminals and base plate
• Planar passivated chip construction for enhanced reliability and robustness

Diode Arrays Applications

• Antiparallel diodes for high-frequency switching devices
• Free-wheeling diodes in converters and motor control circuits
• Rectifiers in switch mode power supplies (SMPS)
• Snubber diodes and anti-saturation protection
• Inductive heating, melting equipment, and uninterruptible power supplies

Diode Arrays Procurement Notes

Verify the specific datasheet revision against the manufacturer's official documentation before finalizing specifications. Confirm that the mounting torque requirements align with the assembly hardware capabilities. Ensure thermal interface materials are compatible with the SOT-227B base plate surface finish. Validate that the application circuit design accounts for the specified transient thermal impedance characteristics.

Diode Arrays Selection Notes

Select this component when high-frequency rectification requires minimal reverse recovery charge and soft switching characteristics. The dual configuration allows for compact designs in bridge or parallel applications. Evaluate the thermal management strategy based on the 1.25 K/W junction-to-case resistance. Consider the 2500 Vrms isolation rating for safety-critical topologies requiring galvanic separation.

Diode Arrays Part Context

This part belongs to the DSEI 2x 30 series of fast recovery epitaxial diodes manufactured by IXYS. It utilizes the standard miniBLOC (SOT-227B) footprint, ensuring compatibility with existing heatsink infrastructure designed for this package style. The series is engineered for high-reliability industrial and commercial power conversion environments.

Diode Arrays Replacement Considerations

The DSEI2X31-12B is a confirmed substitute within the same family, sharing identical electrical ratings and mechanical dimensions.