Memory IC EDB2432BCPE-8D-F-D product image

EDB2432BCPE-8D-F-D

  • Description:IC DRAM 2GBIT PARALLEL 168WFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray

SKU:c8dc179f8b4a Category: Brand:

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EDB2432BCPE-8D-F-D is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 2GBIT PARALLEL 168WFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for EDB2432BCPE-8D-F-D

  • Description:IC DRAM 2GBIT PARALLEL 168WFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR2
  • Memory Size:2Gbit
  • Memory Organization:64M x 32
  • Memory Interface:Parallel
  • Clock Frequency:400 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.14V ~ 1.95V
  • Operating Temperature:-30°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:168-WFBGA
  • Supplier Device Package:168-WFBGA (12x12)
  • Access Time:-

Memory IC datasheet and documents for EDB2432BCPE-8D-F-D

EDB2432BCPE-8D-F-D

Memory IC Overview

EDB2432BCPE-8D-F-D is a 2Gb LPDDR2 SDRAM manufactured by Elpida Memory. It features an 8M x 32 organization across eight banks with a maximum data rate of 800Mbps and a clock frequency of 400MHz. The device utilizes a 168-ball FBGA package measuring 12.0mm x 12.0mm with a 0.5mm pitch. Operating voltages include VDD1 at 1.70V to 1.95V and VDD2/VDDQ at 1.14V to 1.30V. It supports an operating case temperature range from -30°C to +85°C.

Memory IC Feature Summary

  • Complies with JEDEC LPDDR2-S4B standards without implementing a DLL for low power consumption.
  • Supports Package on Package (PoP) integration within the specified FBGA form factor.
  • Includes Mobile RAM functions such as Partial Array Self-Refresh (PASR) and Auto Temperature Compensated Self-Refresh (ATCSR).
  • Features Deep Power-Down mode and Per Bank Refresh capabilities for optimized energy management.

Memory IC Applications

  • Mobile computing devices requiring compact memory solutions
  • Embedded systems utilizing Package on Package configurations
  • Industrial applications operating within standard commercial temperature ranges

Memory IC Procurement Notes

Verify component authenticity through authorized channels due to potential availability constraints. Confirm that the specific ordering suffix matches the required voltage and interface specifications. Ensure compatibility with existing system initialization sequences before procurement. Check for end-of-life status or alternative sourcing options if long-term supply stability is required for production planning.

Memory IC Selection Notes

Select this component when a 32-bit wide interface and 2Gb density are required in a 168-ball footprint. It is suitable for designs needing HSUL_12 signaling and support for partial array self-refresh modes. Consider its voltage requirements and thermal characteristics against system power budgets and environmental constraints.

Memory IC Part Context

This part belongs to the DDR2 Mobile RAM family designed for portable electronics. It represents a high-density solution offering improved bandwidth efficiency compared to previous generations while maintaining low power profiles essential for battery-operated devices.

Memory IC Replacement Considerations

Consult official documentation for direct substitutes. Verify pinout and electrical compatibility if considering cross-vendor alternatives.

Memory IC FAQ

What is the maximum clock frequency supported by this device?

The maximum clock frequency is 400MHz, corresponding to a data rate of 800Mbps.

Does this DRAM implement a Delay-Locked Loop (DLL)?

No, the device does not implement a DLL, which contributes to its low power consumption design.

What is the physical package size of the EDB2432BCPE?

The device is housed in a 168-ball FBGA package with dimensions of 12.0mm x 12.0mm.

EDB2432BCPE-8D-F-DEDB2432BCPE-8D-F-D

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