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EL8200IY is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC OPAMP GP 2 CIRCUIT 10MSOP. Review the specifications below when checking this part for your BOM.
The EL8200IY is a dual-channel, high-speed operational amplifier manufactured by Renesas Electronics Corporation. It features a -3dB bandwidth of 200 MHz and a slew rate of 200 V/µs, designed for applications requiring rapid signal processing. The device operates on supply voltages ranging from 3V to 5.5V with a low supply current of 2mA per channel. It includes a fast-acting disable circuit with 25ns disable and 200ns enable times, making it suitable for multiplexing tasks. The output is rail-to-rail, and inputs extend to 0.15V below the negative supply rail. It is housed in a 10-lead MSOP package and specified for operation over a temperature range of -40°C to +85°C.
Verify the specific suffix 'IY' against the official datasheet to confirm package type and temperature grade. Ensure compatibility with existing board layouts for the 10-lead MSOP footprint. Check for recent product change notices regarding pinout or electrical specifications before finalizing procurement.
Select this component when a dual-channel op-amp with 200MHz bandwidth and low power consumption is required. The integrated disable feature distinguishes it from similar models like the EL8201, which lacks this control function. Consider the 10-lead MSOP package constraints for space-limited designs.
The EL8200IY belongs to the EL8200/EL8201/EL8401 family of 200MHz rail-to-rail amplifiers. While the EL8201 offers identical electrical performance without the disable feature, and the EL8401 provides quad-channel integration, the EL8200 is specifically optimized for applications requiring channel switching via its internal control logic.
The EL8201 serves as a functional substitute if the disable pin is not utilized in the design. Verify that the 10-lead MSOP package dimensions match the target PCB footprint when considering alternative sources.
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