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FA-238 30.0000MA20X-K is listed in the Crystals range at ChipApex. The manufacturer field lists EPSON. Its product description is CRYSTAL 30.0000MHZ 10PF SMD. Review the specifications below when checking this part for your BOM.
The EPSON FA-238 30.0000MA20X-K is a surface-mount crystal unit operating at 30 MHz with ±20 ppm frequency stability and ±50 ppm initial tolerance. It features a 10 pF load capacitance and 40 Ohm equivalent series resistance. The component utilizes fundamental mode operation within a 4-SMD, no-lead package measuring 3.20mm x 2.50mm x 0.70mm. It supports an extended operating temperature range of -40°C to +85°C and complies with RoHS 3 standards.
Verify the specific suffix 'K' against official Epson documentation to confirm the exact frequency tolerance and packaging configuration. Ensure the design accounts for the 10pF load capacitance requirements of the host oscillator circuit. Cross-reference the 40 Ohm ESR with the application schematic to guarantee reliable startup conditions under all environmental conditions.
Select this model when ±20 ppm stability is required across a wide -40°C to +85°C range. Choose the 10pF load capacitance variant if the host circuit matches this specification. Consider the 4-SMD package for automated surface-mount assembly processes. Verify that the 30 MHz frequency aligns with the system timing requirements before finalizing the component selection.
This component belongs to the Epson FA-238 series of crystal units, designed for general-purpose timing applications. The series offers various frequency options and tolerance levels within a standardized small outline package. The FA-238 line is recognized for its reliability and consistency in consumer, industrial, and automotive electronics requiring precise clock signals.
Direct substitutes must match the 30 MHz frequency, 10pF load capacitance, 40 Ohm ESR, and ±20 ppm stability. Compatible alternatives include other manufacturers' 3225-sized crystals with identical electrical parameters. Verify pin compatibility and thermal characteristics when replacing with cross-brand components.
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