FB201209T-331Y-S

$0.29

Description：FERRITE BEAD 330 OHM 0805 1LN
Series：FB
Mfr：Cal-Chip Electronics, Inc.
Package：Tape & Reel (TR),Cut Tape (CT)

SKU:05fc2cd0806a Category: Ferrite Beads and Chips Brand: Cal-Chip Electronics, Inc.

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Product introduction

FB201209T-331Y-S is listed in the Chip Ferrite Bead range at ChipApex. The manufacturer field lists Cal-Chip Electronics, Inc.. Its product description is FERRITE BEAD 330 OHM 0805 1LN. Review the specifications below when checking this part for your BOM.

Chip Ferrite Bead specifications for FB201209T-331Y-S

Description：FERRITE BEAD 330 OHM 0805 1LN
Series：FB
Mfr：Cal-Chip Electronics, Inc.
Package：Tape & Reel (TR),Cut Tape (CT)
Filter Type：-
Number of Lines：1
Impedance @ Frequency：330 Ohms @ 100 MHz
Current Rating (Max)：300mA
DC Resistance (DCR) (Max)：250mOhm
Ratings：-
Operating Temperature：-
Package / Case：0805 (2012 Metric)
Mounting Type：Surface Mount
Height (Max)：0.043" (1.10mm)
Size / Dimension：0.079" L x 0.049" W (2.00mm x 1.25mm)
Features：-

Chip Ferrite Bead datasheet and documents for FB201209T-331Y-S

FB201209T-331Y-S

Chip Ferrite Bead Overview

The FB201209T-331Y-S is a multilayer ferrite chip bead manufactured by Cal-Chip Electronics, Inc. It provides EMI/RFI attenuation in surface mount applications. The component features an impedance of 330 Ohms at 100 MHz and operates within a temperature range of -55°C to +125°C. It utilizes a leadless wound chip design with metal tab electrodes for high reliability.

Chip Ferrite Bead Feature Summary

Multilayer ferrite technology for effective EMI/RFI suppression
Leadless wound chip construction with metal tab electrodes
High resistance to mechanical shock and solder heat
Designed for automatic surface mounting equipment

Chip Ferrite Bead Applications

General purpose EMI suppression in electronic circuits
Surface mount assembly for consumer electronics
Attenuation of noise in signal lines

Chip Ferrite Bead Procurement Notes

Verify the specific datasheet version for the FB201209T-331Y-S to confirm exact electrical tolerances and packaging details. Ensure compatibility with reflow or wave soldering processes as specified in the manufacturer's documentation. Confirm RoHS compliance status directly from the official product sheet before integration into production.

Chip Ferrite Bead Selection Notes

Select this component for applications requiring compact EMI filtering in surface mount designs. The 0805 footprint suits space-constrained boards. Verify that the 330 Ohm impedance at 100 MHz aligns with the target noise frequency spectrum. Ensure the operating temperature range meets the environmental requirements of the final device.

Chip Ferrite Bead Part Context

This part belongs to the Cal-Chip FB series of multilayer ferrite chip beads. These components are engineered for high-density circuitry where traditional wire-wound beads are unsuitable. The series emphasizes robust electrode strength and solderability for automated manufacturing environments.