FDC37C677QFP

Application Specific Microcontrollers Overview

The SMSC FDC37C677QFP is a multifunction peripheral device housed in a 100-pin Quad Flat Package (PQFP). It operates on a 5V supply with a voltage range of 4.5V to 5.5V. The component features an 8-bit external data bus and an 11-bit address bus, ensuring compatibility with ISA bus architectures. Designed for commercial temperature ranges between 0°C and 70°C, it supports a maximum functional clock frequency of 14.32 MHz. This Super I/O controller integrates intelligent power management and register sets compliant with PC98/99 and ACPI 1.0 standards.

Application Specific Microcontrollers Feature Summary

• ISA Plug-and-Play compatible register set
• Supports PC98/99 and ACPI 1.0 compliance
• Intelligent auto power management capabilities
• Shadowed write-only registers for ACPI compliance

Application Specific Microcontrollers Applications

• Super I/O controller implementation in personal computers
• System management in PC98/99 architecture platforms
• ACPI 1.0 compliant motherboard designs

Application Specific Microcontrollers Procurement Notes

Verify the specific suffix 'QFP' against manufacturer documentation to confirm package type and pinout configuration. Ensure the component meets the required commercial temperature grade (0°C to 70°C) for the intended application environment. Cross-reference the 5V operation requirement with system power rails to prevent electrical mismatch.

Application Specific Microcontrollers Selection Notes

Select this component when an ISA-compatible Super I/O solution is required for legacy or specific industrial PC architectures. The 100-pin PQFP package necessitates adequate PCB space and thermal management within the commercial temperature range. Confirm that the target system supports the 14.32 MHz maximum clock frequency and utilizes an 8-bit data bus interface for proper integration.

Application Specific Microcontrollers Part Context

The FDC37C677 belongs to the Enhanced Super I/O Controller family manufactured by SMSC. These devices are designed to consolidate standard I/O functions into a single chip, reducing board complexity. The QFP variant indicates a surface-mount plastic quad flat package, distinguishing it from other packaging options within the same functional series.