FEPF16GT-E3/45

Diode Arrays Overview

The FEPF16GT-E3/45 is a silicon rectifier diode from Vishay General Semiconductor, housed in a TO-220F package. It features a peak repetitive reverse voltage of 400 V and a maximum continuous forward current of 16 A. The device exhibits a peak non-repetitive forward surge current capability of 125 A and a typical peak reverse recovery time of 50 ns. Forward voltage drop is specified at 1.3 V under rated conditions, with a maximum reverse leakage current of 10 µA at the rated voltage.

Diode Arrays Feature Summary

• Utilizes fast recovery silicon technology for efficient switching operations
• Designed for through-hole mounting to facilitate thermal management
• Constructed with robust encapsulation to withstand high surge currents

Diode Arrays Applications

• High-frequency power supply circuits
• Inductive load switching applications
• Free-wheeling rectification in motor drives

Diode Arrays Procurement Notes

Verify the specific suffix against official Vishay documentation to confirm pinout orientation and thermal pad configuration. Ensure the ordering part number matches the exact voltage and current ratings required for the target circuit design before finalizing procurement.

Diode Arrays Selection Notes

Select this component when a 16 A current rating and 400 V blocking voltage are required in a standard through-hole form factor. Consider the 50 ns recovery time suitability for the operating frequency. Evaluate thermal dissipation requirements based on the 1.3 V forward voltage drop at full load.

Diode Arrays Part Context

This component belongs to the FEP series of fast recovery rectifiers manufactured by Vishay. These devices are engineered for general-purpose high-speed switching applications requiring reliable performance in compact through-hole packages. The series offers a balance of current handling capacity and rapid recovery characteristics.

Diode Arrays Replacement Considerations

Direct substitutes include the FEP16GT-E3/45 variant which shares identical electrical specifications and physical dimensions. Verify compatibility with existing PCB footprints and thermal interface requirements when transitioning between these equivalent part numbers.