FFAF20U60DNTU

Diode Arrays Overview

The FFAF20U60DNTU is a fast recovery rectifier diode array manufactured by onsemi. It features a dual common cathode configuration housed in a TO-3PF (TO-220AB Full Pack) through-hole package. The device supports a maximum repetitive peak reverse voltage of 600 V and an average forward rectified current of 20 A per leg. Key electrical parameters include a maximum forward voltage of 2.2 V at 20 A, a reverse leakage current of 10 µA at 600 V, and a typical reverse recovery time of 90 ns. The unit operates within a junction temperature range of -65°C to +150°C.

Diode Arrays Feature Summary

• Dual common cathode configuration for efficient bridge or freewheeling applications
• Fast recovery characteristics with 90 ns reverse recovery time
• High thermal performance via TO-3PF full pack mounting

Diode Arrays Applications

• Industrial motor drives and inverters
• DC-DC converter output rectification
• Uninterruptible power supply (UPS) systems

Diode Arrays Procurement Notes

Verify the specific suffix 'NTU' against the official datasheet to confirm the tube packaging format. Confirm RoHS compliance status and material composition declarations directly from the manufacturer's documentation prior to integration. Ensure the procurement channel provides valid traceability for this discontinued or limited-stock component type.

Diode Arrays Selection Notes

Select this component when a dual common cathode topology is required for high-current applications up to 20 A per leg. The 600 V rating suits medium-voltage industrial environments. Consider the TO-3PF package for superior heat dissipation compared to standard TO-220 variants. Verify that the 90 ns recovery time meets the switching frequency requirements of the target circuit design.

Diode Arrays Part Context

This part belongs to onsemi’s FFA series of ultrafast and fast recovery rectifiers. These devices are engineered for high-efficiency power conversion where low reverse recovery charge is critical. The FFAF20U60DNTU specifically targets applications requiring robust current handling and fast switching speeds in a rugged through-hole package suitable for high-power density designs.

Diode Arrays Replacement Considerations

Consult the official onsemi replacement guide for direct pin-compatible substitutes. Cross-reference specifications such as Vf, Ir, and trr to ensure functional equivalence. Verify package dimensions and thermal characteristics before substituting.