Diode Arrays FMXS-4202S product image

FMXS-4202S

  • Description:DIODE ARRAY GP 200V 20A TO-3PF
  • Series:-

SKU:f264f2ba9b77 Category: Brand:

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FMXS-4202S is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Sanken Electric USA Inc.. Its product description is DIODE ARRAY GP 200V 20A TO-3PF. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for FMXS-4202S

  • Description:DIODE ARRAY GP 200V 20A TO-3PF
  • Series:-
  • Mfr:Sanken Electric USA Inc.
  • Package:Bulk
  • Diode Configuration:1 Pair Common Cathode
  • Technology:Standard
  • Voltage - DC Reverse (Vr) (Max):200 V
  • Current - Average Rectified (Io) (per Diode):20A
  • Voltage - Forward (Vf) (Max) @ If:1.05 V @ 10 A
  • Speed:Fast Recovery =< 500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):30 ns
  • Current - Reverse Leakage @ Vr:50 µA @ 200 V
  • Operating Temperature - Junction:-40°C ~ 150°C
  • Mounting Type:Through Hole
  • Package / Case:TO-3P-3 Full Pack
  • Supplier Device Package:TO-3PF
  • Grade:-
  • Qualification:-

Diode Arrays datasheet and documents for FMXS-4202S

FMXS-4202S

Diode Arrays Overview

The FMXS-4202S is a fast recovery diode (FRD) manufactured by Sanken Electric, housed in a TO-3PF three-pin high-current package. It provides a peak reverse voltage of 200 V and an average forward current rating of 20 A. The device features a maximum forward voltage drop of 1.05 V at 10 A and a reverse recovery time of 30 ns under specified conditions. Thermal resistance between the junction and case is limited to 2.0 °C/W. The component operates within a junction temperature range of -40°C to +150°C.

Diode Arrays Feature Summary

  • Ultrafast recovery characteristics optimized for high-speed switching applications
  • Balanced low forward voltage and high-speed performance at elevated temperatures
  • Effective heat radiation capabilities provided by the high-current package design
  • Enhanced isolation performance achieved through a full mold encapsulation structure

Diode Arrays Applications

  • DC-DC converters
  • High current secondary rectifier circuits
  • High frequency rectifier circuits

Diode Arrays Procurement Notes

Verify the specific manufacturer designation and datasheet version before procurement. Confirm that the TO-3PF package dimensions align with your thermal management requirements. Ensure compatibility with existing circuit designs regarding peak reverse voltage and surge current ratings. Check for any updated replacement recommendations due to the component status.

Diode Arrays Selection Notes

Select this component for applications requiring robust high-current handling alongside rapid switching speeds. Evaluate the thermal resistance specifications against your system's cooling capabilities. Consider the junction temperature limits when designing for high ambient environments. Verify that the 200 V reverse voltage rating meets the peak transient requirements of the target circuit topology.

Diode Arrays Part Context

This component belongs to Sanken Electric's series of fast recovery diodes designed for power electronics. It utilizes a TO-3PF package to manage significant current loads while maintaining compact form factors. The device targets industrial and commercial power conversion systems where efficiency and thermal stability are critical operational parameters.

Diode Arrays Replacement Considerations

The datasheet explicitly states that the FMXS-4202S is not recommended for new designs. Engineers should consult official Sanken Electric documentation for approved substitute part numbers or next-generation alternatives suitable for modern implementations.

Diode Arrays FAQ

What is the maximum junction temperature for the FMXS-4202S?

The maximum operating junction temperature is +150°C.

Does the FMXS-4202S support high-frequency operation?

Yes, it is designed as an ultrafast recovery diode with a reverse recovery time of 30 ns, suitable for high-frequency rectifier circuits.

What is the thermal resistance from junction to case?

The thermal resistance between the junction and the case is 2.0 °C/W maximum.

FMXS-4202SFMXS-4202S

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