FSBS10CH60

Power Driver Modules Overview

The FSBS10CH60 is a Motion SPM® 3 Series intelligent power module designed for three-phase AC induction, BLDC, and PMSM motor drives. It integrates a 600 V, 10 A IGBT inverter with optimized gate drivers and protection circuits. The module features low-loss short-circuit rated IGBTs on a ceramic substrate for reduced thermal resistance. It includes under-voltage lockouts, over-current shutdown, and fault reporting via a dedicated output pin. Separate negative terminals support diverse control algorithms.

Power Driver Modules Feature Summary

• Integrates a fully featured three-phase inverter stage with optimized gate drive to minimize EMI and switching losses.
• Includes built-in high-speed HVIC requiring only a single supply voltage to translate logic-level inputs to high-voltage drive signals.
• Provides comprehensive protection mechanisms including under-voltage lockout, short-circuit shutdown, and active fault signaling.
• Features separate open-emitter pins from low-side IGBTs to facilitate precise three-phase current sensing.

Power Driver Modules Applications

• Motion control systems for home appliances
• Industrial motor drives
• AC Induction motor inverters
• BLDC and PMSM motor controllers

Power Driver Modules Procurement Notes

Verify the specific revision code (e.g., Rev. C6) against the latest datasheet before procurement. Confirm that the application environment remains within the specified operating temperature range of -20°C to 100°C case temperature. Ensure the DC-link voltage does not exceed the absolute maximum rating of 450 V during normal operation or 500 V during surge conditions to prevent device failure.

Power Driver Modules Selection Notes

Select this module when a compact solution for three-phase motor control is required without external discrete components. It is suitable for applications needing integrated short-circuit protection and current sensing capabilities. Verify that the PCB layout can accommodate the 27-pin SPMBA-027 package and that the mounting torque requirements are met to ensure proper thermal contact and mechanical stability.

Power Driver Modules Part Context

This component belongs to the Motion SPM® 3 Series family from ON Semiconductor, formerly Fairchild Semiconductor. The series is engineered specifically for motor drive applications, combining power switching and control logic into a single package. This integration simplifies system design by reducing component count and board space while maintaining high reliability through robust internal protection features.

Power Driver Modules Replacement Considerations

FSBB10CH60DF

Power Driver Modules FAQ

How is the fault output pulse width determined?

The fault output pulse width is set by connecting an external capacitor between the CFOD pin and the COM pin. The approximate relationship is defined by the equation: CFOD = 18.3 x 10^-6 x tFOD.

What is the isolation rating of the module?

The module provides an isolation rating of 2500 Vrms at 60 Hz sinusoidal AC for one minute, measured between the connected pins and the heat sink plate.

Can the module be driven directly by an MCU?

Yes, the input interface is active-HIGH and works with standard 3.3 V or 5 V logic levels. Direct coupling to MCU terminals is possible without optocouplers due to the integrated HVIC.