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FST32253M is listed in the Signal Switches, Multiplexers, Decoders range at ChipApex. The manufacturer field lists Fairchild Semiconductor. Its product description is MUX AND DEMUX/DECODER. Review the specifications below when checking this part for your BOM.
The FST32253M is a dual 4:1 high-speed CMOS TTL-compatible multiplexer/demultiplexer bus switch manufactured by Fairchild Semiconductor. It features low on-resistance to support efficient signal transmission. The device operates with a single voltage supply source and includes one independent circuit configuration for each of its two channels. Designed for surface mount applications, it is housed in a 16-SOIC package with a width of 0.154 inches (3.90mm). The component supports an operating temperature range from -40°C to 85°C.
Verify the manufacturer marking matches Fairchild Semiconductor or ON Semiconductor branding. Confirm the package type is 16-SOIC and the suffix 'M' indicates the specific tape-and-reel or bulk variant as per the official datasheet. Check RoHS status compliance if required for your assembly process. Ensure the operating temperature range meets your environmental specifications.
Select this component when a dual-channel 4-to-1 signal path is required within a compact surface-mount footprint. The TTL compatibility simplifies interface design with standard logic families. Consider the low on-resistance for applications demanding minimal voltage drop across the switch. Verify that the single supply voltage requirement aligns with your system power rails.
This part belongs to the FST series of high-speed bus switches designed for digital signal processing applications. It serves as a critical interconnect element in systems requiring dynamic signal routing between multiple sources and destinations. The dual configuration allows for parallel data handling, enhancing system throughput compared to single-channel alternatives.
Consult official cross-reference lists for equivalents such as the FST32253. Ensure any substitute maintains the 16-SOIC package dimensions and electrical characteristics. Verify pinout compatibility to avoid PCB redesign. Confirm that the alternative device supports the same operating temperature range and voltage supply requirements.
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