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FT221XQ-R is listed in the Controllers range at ChipApex. The manufacturer field lists FTDI, Future Technology Devices International Ltd. Its product description is IC USB 8 BIT SPI/FT1248 20QFN. Review the specifications below when checking this part for your BOM.
The FT221XQ-R is a USB to 8-bit SPI/FT1248 interface controller manufactured by FTDI. It operates as a Full Speed USB 2.0 device with a data rate of 12 Mb/s and supports High-Speed operation at 480 Mb/s. The component functions as a bridge between USB and synchronous serial protocols, specifically supporting 8-bit wide SPI or FT1248 interfaces. It is housed in a 20-pin QFN EP package designed for surface mount technology. The device requires a supply voltage ranging from 2.97 V to 5.5 V and draws an operating supply current between 9.7 mA and 12.3 mA. It is rated for an industrial temperature range of -40°C to +85°C.
Verify the specific suffix against official documentation to confirm packaging type and reel specifications. Ensure compatibility with the target PCB footprint for the 20-pin QFN EP package. Confirm that the required operating voltage and current draw align with the system power design constraints before finalizing procurement.
Select this component when an 8-bit wide synchronous serial interface is required over USB 2.0. It is suitable for applications needing internal protocol handling without external microcontroller intervention. Consider the QFN-20 package size and thermal characteristics during layout planning.
This part belongs to the FT-X family of USB interface controllers from FTDI. It is functionally related to the FT221XQ-T, which shares the same core specifications but utilizes a tray packaging format instead of tape and reel. Both variants serve the same bridge controller role within the X-Chip series.
The FT221XQ-T is a verified substitute offering identical electrical and functional specifications. It differs only in its packaging configuration, utilizing trays rather than tape and reel. Verify that the manufacturing facility can accommodate the alternative packaging method.
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