Diode Arrays HFA08TA60CS product image

HFA08TA60CS

$1.62
  • Description:DIODE ARRAY GP 600V 4A TO263AB
  • Series:HEXFRED®

SKU:368860ca3ca3 Category: Brand:

  
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HFA08TA60CS is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Vishay General Semiconductor - Diodes Division. Its product description is DIODE ARRAY GP 600V 4A TO263AB. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for HFA08TA60CS

  • Description:DIODE ARRAY GP 600V 4A TO263AB
  • Series:HEXFRED®
  • Mfr:Vishay General Semiconductor - Diodes Division
  • Package:Tube
  • Diode Configuration:1 Pair Common Cathode
  • Technology:Standard
  • Voltage - DC Reverse (Vr) (Max):600 V
  • Current - Average Rectified (Io) (per Diode):4A (DC)
  • Voltage - Forward (Vf) (Max) @ If:1.8 V @ 4 A
  • Speed:Fast Recovery =< 500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):42 ns
  • Current - Reverse Leakage @ Vr:3 µA @ 600 V
  • Operating Temperature - Junction:-55°C ~ 150°C
  • Mounting Type:Surface Mount
  • Package / Case:TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
  • Supplier Device Package:TO-263AB (D2PAK)
  • Grade:-
  • Qualification:-

Diode Arrays datasheet and documents for HFA08TA60CS

HFA08TA60CS

Diode Arrays Overview

The HFA08TA60CS is a HEXFRED ultrafast soft recovery diode featuring a dual common cathode configuration in a D2PAK package. It provides a maximum repetitive reverse voltage of 600 V and supports a continuous forward current of 4 A per leg (8 A total). The device exhibits a typical reverse recovery time of 17 ns, with a peak reverse recovery charge of 40 nC at 25 °C. Maximum forward voltage drop is rated at 1.8 V at 4 A. Operating junction temperature ranges from -55 °C to +150 °C.

Diode Arrays Feature Summary

  • Ultrafast soft recovery characteristics designed to minimize switching losses and electromagnetic interference.
  • Extremely low peak reverse recovery current and stored charge values for enhanced efficiency.
  • Robust construction utilizing advanced epitaxial processing techniques for industrial reliability.

Diode Arrays Applications

  • Companion diodes for IGBTs and MOSFETs
  • High-speed power supplies
  • Power conversion systems such as inverters
  • Motor drives

Diode Arrays Procurement Notes

Verify the specific ordering suffix against official Vishay documentation to confirm exact electrical tolerances and packaging specifications. Ensure compliance with RoHS directives if required by the application environment. Confirm thermal management requirements align with the specified junction-to-case thermal resistance values provided in the datasheet.

Diode Arrays Selection Notes

Select this component for applications requiring high-frequency operation with minimal snubbing circuitry. The ultrafast recovery profile reduces stress on switching transistors. Evaluate thermal dissipation needs based on the specified power dissipation ratings at various case temperatures to ensure reliable operation within the designated temperature range.

Diode Arrays Part Context

This part belongs to the HEXFRED product line from Vishay High Power Products, specializing in ultrafast soft recovery diodes. The series is engineered for superior performance in high-efficiency power electronics, offering a combination of speed and low noise that surpasses previous rectifier technologies available in the market.

Diode Arrays Replacement Considerations

Consult official Vishay substitution guides for verified alternatives. Generic replacements may not match the specific soft recovery characteristics or thermal performance required for sensitive high-frequency circuits.

Diode Arrays FAQ

What is the typical reverse recovery time for the HFA08TA60CS?

The typical reverse recovery time is 17 ns under standard test conditions.

Does the HFA08TA60CS exhibit snap-off behavior during recovery?

No, the device does not exhibit any tendency to snap-off during the tb portion of recovery.

What is the maximum operating junction temperature?

The maximum operating junction temperature is 150 °C.

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