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HMA2701R1 is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists onsemi. Its product description is OPTOISO 3.75KV 1CH TRANS 4-SMD. Review the specifications below when checking this part for your BOM.
The HMA2701R1 is a single-channel transistor output optocoupler manufactured by onsemi. It integrates an infrared emitting diode and an NPN phototransistor in a compact SMD-4 package. The device provides electrical isolation with a rated insulation voltage of 3750 Vrms. Key electrical parameters include a maximum collector-emitter voltage of 40 V, a maximum DC forward current of 50 mA, and a typical forward voltage of 1.3 V. The current transfer ratio ranges from 80% to 160% at a forward current of 5 mA. Operating temperature spans from -40°C to +100°C.
Verify component authenticity through authorized distribution channels due to obsolete status. Confirm package integrity and pin alignment upon receipt. Check datasheet revisions for any historical parameter updates. Ensure storage conditions meet manufacturer specifications to prevent degradation. Validate compatibility with existing PCB footprints before final integration.
Select this component when high isolation voltage is required in a small surface-mount footprint. Consider the 40V output voltage limit and 80mA collector current capability for load matching. Evaluate thermal performance within the specified operating temperature range. Compare against active replacements if long-term supply stability is critical for the design lifecycle.
This part belongs to the family of transistor output optoisolators designed for general-purpose isolation applications. It serves as a legacy component for designs requiring robust galvanic isolation. The SMD-4 form factor allows for space-constrained board layouts. It represents a standard solution for interfacing low-voltage logic with higher voltage domains safely.
FODM2701R2 is a confirmed substitute part number available from onsemi. Verify pinout compatibility and electrical parameter overlaps before substitution. Review datasheet differences regarding current transfer ratio and saturation voltage. Ensure mechanical dimensions match the existing PCB layout to avoid rework.
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