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INN4575F-H175-TL is listed in the AC DC Converters, Offline Switchers range at ChipApex. The manufacturer field lists Power Integrations. Its product description is IC OFFLINE SW FLBACK INSOP-T28D. Review the specifications below when checking this part for your BOM.
The INN4575F-H175-TL is a PowiGaN AC/DC converter IC from the InnoSwitch4-Pro family, designed for high-density power supplies. It integrates a 700 V GaN switch with primary-side regulation and digital control. The device supports an input voltage range of 85-265 VAC and delivers up to 90 W output power. It utilizes the InSOP-T28D package and operates at a maximum temperature of +150 °C.
Verify the specific suffix (H175) against official datasheets to confirm pinout and electrical characteristics match design requirements. Confirm moisture sensitivity level (MSL) handling procedures are followed during assembly. Ensure the InSOP-T28D package footprint aligns with PCB layout specifications. Cross-reference ordering information with manufacturer documentation to avoid variant confusion.
Select this component for applications requiring high power density and efficiency in compact form factors. The integrated GaN technology reduces external component count compared to traditional silicon solutions. Primary-side regulation simplifies feedback loop design. Consider thermal management requirements due to high integration levels within the InSOP-T28D package.
This part belongs to the InnoSwitch4-Pro series, which represents Power Integrations' advanced PowiGaN technology. It succeeds earlier generations by offering improved digital control features and higher power capabilities within the same package footprint. The series targets modern power supply designs demanding strict size and efficiency constraints.
Direct replacements include other variants within the InnoSwitch4-Pro family such as INN4576F or INN4577F, depending on required power output. Verify that substitute parts maintain compatible input voltage ranges and package dimensions. Check for any differences in digital control configuration or thermal performance characteristics.
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