ISL3159EIRZ

Overview

The ISL3159EIRZ is a half-duplex RS-485/RS-422 transceiver manufactured by Renesas Electronics Corporation. It supports data rates up to 40 Mb/s and operates within a supply voltage range of 4.5 V to 5.5 V. The device features ±15 kV IEC ESD protection on the bus pins and includes a shutdown mode with low current consumption. It is housed in a 10-lead VFDFN package (3x3 mm) with an exposed pad for thermal dissipation. The component is rated for industrial operating temperatures from -40°C to +85°C.

Feature Summary

• Integrated ±15 kV IEC ESD protection on differential bus lines
• Supports high-speed data transmission up to 40 Mb/s
• Low power shutdown mode reduces standby current consumption
• Full failsafe receiver ensures defined output states during open or shorted bus conditions

Applications

• Industrial sensor networks requiring robust communication
• Building automation systems utilizing RS-485 buses
• Factory automation control panels
• Multi-drop communication links in harsh electrical environments

Procurement Notes

Verify the specific suffix 'IRZ' confirms the RoHS-compliant tube packaging variant. Confirm the manufacturer status as active, noting that related tape-and-reel variants may have different availability. Ensure the 10-DFN footprint matches the PCB layout requirements before ordering.

Selection Notes

Select this component when a 5 V supply is available and high ESD immunity is critical for the application. The 10-lead DFN package is suitable for space-constrained designs. Compare against the ISL3159EIBZ if an SOIC-8 package is preferred instead of surface-mount DFN.

Part Context

This part belongs to the ISL3159E series of high-speed RS-485 transceivers. It shares core specifications with other variants in the family but differs in packaging and shipping format. The IRZ designation specifically identifies the tube-packaged version of the industrial temperature grade device.

Replacement Considerations

The ISL3159EIBZ serves as a pin-compatible alternative offering the same electrical performance in an SOIC-8 package. Verify that the target PCB footprint accommodates the selected package type.