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ISL32433EIBZ-T7A is listed in the Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC TRANSCEIVER FULL 1/1 14SOIC. Review the specifications below when checking this part for your BOM.
The ISL32433EIBZ-T7A is a half-duplex transceiver manufactured by Renesas Electronics Corporation, designed for RS-485 and RS-422 communication protocols. It integrates one driver and one receiver within an 8-SOIC surface-mount package. The device supports data rates up to 1 Mbps and operates on a single power supply ranging from 3V to 5.5V. Key electrical specifications include a receiver input hysteresis of 30 mV and a common-mode rejection capability supporting voltages up to ±15V. The component is rated for an extended operating temperature range from -40°C to +85°C and features overvoltage protection on the bus pins.
Verify the specific suffix 'T7A' against the manufacturer's current datasheet to confirm tape-and-reel packaging and lead-free status. Cross-reference the part number with official Renesas documentation to ensure compliance with RoHS directives and REACH regulations before finalizing procurement orders.
Select this component when designing circuits requiring robust fault protection for RS-485/RS-422 buses in industrial environments. Ensure the system voltage aligns with the 3V to 5.5V supply range and that the 1 Mbps data rate meets the application's throughput requirements while considering the 8-SOIC footprint constraints.
This part belongs to the ISL3243xE family of fault-protected transceivers. It shares functional similarities with other members like the ISL32432E but differs in pinout configuration and specific protocol optimization. The EIBZ suffix indicates a specific package variant and manufacturing revision within the broader Renesas interface IC portfolio.
Direct substitutes may include the ISL32432EIBZ-T7A or ISL32435EIBZ-T7A, provided pin compatibility and protocol support match the original design requirements. Verify thermal characteristics and package dimensions before swapping components.
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