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JANSF2N3700UB/TR is listed in the Single Bipolar Transistors range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is TRANS NPN 80V 1A UB. Review the specifications below when checking this part for your BOM.
The JANSF2N3700UB/TR is a silicon NPN small-signal bipolar junction transistor (BJT) manufactured by Microchip Technology. It features an SMD/SMT mounting style in an SMD-4 package configuration. The device supports a maximum DC collector current of 1 A and a collector-emitter voltage (VCEO) of 80 V. Additional voltage ratings include a collector-base voltage (VCBO) of 140 V and an emitter-base voltage (VEBO) of 7 V. Power dissipation is rated at 500 mW, with an operating temperature range spanning from -65 C to +200 C.
Verify the specific suffix designations against official Microchip documentation to ensure correct packaging and reliability grade alignment. Confirm that the SMD-4 footprint matches the target PCB layout requirements. Validate compliance with relevant military or industrial standards required for the intended deployment environment before finalizing procurement decisions.
Select this component when a surface-mount NPN BJT is required for high-temperature environments up to 200 C. Ensure the circuit design accommodates the 500 mW power dissipation limit within the SMD-4 package constraints. Compare electrical characteristics against alternative packages if through-hole mounting is preferred for mechanical stability.
This part belongs to the 2N3700 family of small-signal transistors produced by Microchip Technology. It represents a specialized variant optimized for surface-mount technology while maintaining the electrical specifications associated with the broader 2N3700 series. The product line targets sectors demanding high reliability and extended temperature operation capabilities.
Consult official substitution guides for equivalent parts such as JAN2N3700UB/TR or JANSU2N3700UB. Verify pinout compatibility and thermal management requirements when transitioning between different package styles within the same functional family.
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