JANTXV1N6642UBD/TR

$25.28

Description：DIODE ARRAY GP 75V 300MA UB
Series：-

SKU:3a6c0d575689 Category: Diode Arrays Brand: Microchip Technology

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Product introduction

JANTXV1N6642UBD/TR is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is DIODE ARRAY GP 75V 300MA UB. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for JANTXV1N6642UBD/TR

Description：DIODE ARRAY GP 75V 300MA UB
Series：-
Mfr：Microchip Technology
Package：Tape & Reel (TR)
Diode Configuration：1 Pair Series Connection
Technology：Standard
Voltage - DC Reverse (Vr) (Max)：75 V
Current - Average Rectified (Io) (per Diode)：300mA
Voltage - Forward (Vf) (Max) @ If：1.2 V @ 100 mA
Speed：Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)：20 ns
Current - Reverse Leakage @ Vr：500 nA @ 75 V
Operating Temperature - Junction：-65°C ~ 175°C
Mounting Type：Surface Mount
Package / Case：3-SMD, No Lead
Supplier Device Package：UB
Grade：Military
Qualification：MIL-PRF-19500/578

Diode Arrays datasheet and documents for JANTXV1N6642UBD/TR

JANTXV1N6642UBD/TR

Diode Arrays Overview

The JANTXV1N6642UBD/TR is a silicon switching diode manufactured by Microchip Technology, designed for high-reliability applications. It features a peak reverse voltage of 75 V and an average forward current rating of 300 mA. The device supports a maximum surge current of 2.5 A and exhibits a fast recovery time of 5 ns. Electrical characteristics include a forward voltage of 1.2 V and a reverse leakage current of 500 nA. It operates within a temperature range of -65°C to +175°C and utilizes a three-pin ceramic surface-mount package.

Diode Arrays Feature Summary

High-temperature operation capability up to 175°C for demanding environments
Fast switching performance with 5 ns recovery time
Robust construction using ceramic surface-mount packaging

Diode Arrays Applications

Computer logic circuits
Signal processing systems
High-reliability aerospace electronics

Diode Arrays Procurement Notes

Verify the specific suffix configuration against official Microchip documentation to ensure correct pinout and electrical ratings. Confirm that the ceramic package variant matches the design requirements for thermal management and mechanical stability. Cross-reference the manufacturing date code and quality certification levels to ensure compliance with project specifications before finalizing procurement orders.

Diode Arrays Selection Notes

Select this component when a small-signal switching diode with extended temperature tolerance is required. The ceramic SMT package offers superior environmental resistance compared to standard plastic variants. Ensure the circuit design accommodates the 75 V reverse voltage limit and 300 mA forward current constraints while leveraging the fast 5 ns switching speed for optimal signal integrity.

Diode Arrays Part Context

This part belongs to the JANTXV series of radiation-hardened or high-reliability silicon diodes produced by Microchip Technology. It is functionally related to the standard 1N6642 specification but meets stricter military-grade quality standards. The UBD suffix indicates a specific surface-mount ceramic package configuration distinct from through-hole or standard plastic SMD versions.