JS27HP8G08SDDA-45-SU

Memory IC Overview

The JS27HP8G08SDDA-45-SU is an 8 Gbit NAND Flash memory device manufactured by Jeju Semiconductor Corp. It features a x8 I/O interface and operates with a Vcc supply voltage range of 1.7V to 1.95V. The component utilizes a 63-Ball FBGA package measuring 9.0 x 11.0 mm. It supports ONFI 1.0 compliant command sets and includes integrated 4-bit ECC for error correction over 528 bytes. The device provides hardware data protection, copy-back program capabilities, and cache read functions to enhance system performance.

Memory IC Feature Summary

• Supports Copy Back Program for fast data rewriting without external buffering
• Includes Cache Read function utilizing internal buffers to improve read throughput
• Features Chip Enable Don't Care functionality for simplified microcontroller interfaces
• Provides Hardware Data Protection against unintended program or erase operations during power transitions

Memory IC Applications

• Solid state mass storage applications
• Digital camera systems
• Digital video and imaging devices
• DVD and VCD players

Memory IC Procurement Notes

Verify the specific ordering suffix 'SU' corresponds to the standard industrial temperature grade (-40°C to 85°C) as defined in the official datasheet. Confirm that the x8 interface configuration matches the target system bus width requirements. Ensure the 1.8V supply voltage domain aligns with the controller's operating specifications before finalizing procurement.

Memory IC Selection Notes

Select this component when an 8 Gbit density with x8 parallel interface is required within a compact 63-ball FBGA footprint. It is suitable for designs constrained to a 1.8V logic supply level. Consider the device if the application demands ONFI 1.0 compatibility and benefits from internal ECC handling to reduce host processor overhead.

Memory IC Part Context

This part belongs to the JSC NAND Series, which offers cost-effective solutions for solid-state mass storage markets. The series integrates 1Gb, 2Gb, 4Gb, and 8Gb densities sharing pinout compatibility across all variants. The 8Gb variant specifically utilizes a Double Die Package (DDP) architecture with two stacked dies managed under a single Chip Enable signal.

Memory IC Replacement Considerations

Consult the manufacturer's official documentation for confirmed substitute part numbers. Verify compatibility regarding voltage levels, interface widths, and package dimensions when evaluating alternatives.