K2200GHURP

DIACs, SIDACs Overview

The Littelfuse K2200GHURP is a high-voltage trigger diode, classified as a Sidac within the Teccor product family. It is designed for through-hole mounting in a DO-15-2 package. The device features a breakover voltage (VBO) of 220 V and a maximum holding current (Ih) of 80 mA. It supports an RMS on-state current (It RMS) of 1 A and can withstand non-repetitive on-state currents of 16.7 A or 20 A. The component operates within a temperature range of -40 °C to +150 °C.

DIACs, SIDACs Feature Summary

• Bidirectional switching capability for AC circuit protection applications
• High surge current handling with robust non-repetitive on-state ratings
• Thermal stability across extended industrial operating temperatures

DIACs, SIDACs Applications

• Overvoltage protection circuits
• Triggering devices for thyristors and triacs
• Lightning arresters

DIACs, SIDACs Procurement Notes

Verify the specific suffix URP against official Littelfuse documentation to confirm reel packaging and RoHS compliance status. Confirm that the DO-15-2 through-hole package matches the target PCB footprint requirements before finalizing procurement orders.

DIACs, SIDACs Selection Notes

Select this component when a 220 V breakover threshold is required for triggering or protection. Ensure the application current does not exceed the 1 A RMS rating. Verify that the DO-15-2 package size fits the assembly constraints compared to surface-mount alternatives like the K2200S1URP.

DIACs, SIDACs Part Context

This part belongs to the Kxxx0yH series of Sidacs manufactured by Littelfuse under the Teccor brand. It serves as a bidirectional trigger diode used primarily for protecting sensitive electronic components from voltage spikes and for initiating conduction in other semiconductor switches.

DIACs, SIDACs Replacement Considerations

The K2200S1URP offers similar electrical characteristics but utilizes a DO-214AC surface-mount package instead of the through-hole DO-15-2 form factor. Designers must account for significant differences in physical mounting and thermal dissipation capabilities when substituting between these packages.