Balun LDB211G6005C-001 product image

LDB211G6005C-001

$0.07
  • Description:MULTI-LAY HYBRID BALUNS 0805
  • Series:LDB21
  • Mfr:Murata Electronics
  • Package:Tape & Reel (TR)

SKU:2eb523954c94 Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

LDB211G6005C-001 is listed in the Balun range at ChipApex. The manufacturer field lists Murata Electronics. Its product description is MULTI-LAY HYBRID BALUNS 0805. Review the specifications below when checking this part for your BOM.

Balun specifications for LDB211G6005C-001

  • Description:MULTI-LAY HYBRID BALUNS 0805
  • Series:LDB21
  • Mfr:Murata Electronics
  • Package:Tape & Reel (TR)
  • Frequency Range:-
  • Impedance - Unbalanced/Balanced:-
  • Phase Difference:-
  • Insertion Loss (Max):-
  • Return Loss (Min):-
  • Package / Case:-
  • Mounting Type:-

Balun datasheet and documents for LDB211G6005C-001

LDB211G6005C-001

Balun Overview

The LDB211G6005C-001 is a hybrid balun from Murata Electronics, designed for signal conditioning in RF applications. It operates at a frequency of 1.6 GHz with a 50 Ohm impedance. The component utilizes SMD/SMT termination and is housed in an 0805 (2012 metric) package. It functions within a temperature range of -40°C to +85°C. Insertion loss is specified as a maximum of 0.8 dB at 25°C and 0.9 dB across the extended temperature range.

Balun Feature Summary

  • Multi-layer hybrid construction for compact integration
  • Balanced-to-unbalanced signal conversion capability
  • Surface-mount design suitable for automated assembly

Balun Applications

  • RF wireless communication systems
  • Signal conditioning circuits
  • Balun implementations in mobile devices

Balun Procurement Notes

Verify part authenticity through authorized distributors or direct manufacturer channels. Confirm that the specific suffix matches the required electrical specifications. Check for obsolescence status, as availability may vary. Ensure compliance with RoHS standards if required by your manufacturing process. Validate datasheet revisions against current production batches.

Balun Selection Notes

Select this component when a 1.6 GHz operation point is required with 50 Ohm impedance matching. The 0805 footprint is appropriate for space-constrained PCB layouts. Consider the insertion loss specifications relative to system noise requirements. Evaluate thermal performance within the -40°C to +85°C operational window for environmental suitability.

Balun Part Context

This device belongs to the LDB series of chip multilayer hybrid baluns manufactured by Murata Electronics. These components are engineered for high-frequency signal processing tasks. The series offers various impedance and frequency configurations tailored for modern electronic designs requiring balanced transmission lines.

Balun Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Consult official Murata resources for cross-reference data.

LDB211G6005C-001LDB211G6005C-001
$0.07
Buy Now

Recent News