LDB211G6020C-001

Balun Overview

The LDB211G6020C-001 is a multi-layer hybrid balun manufactured by Murata Electronics, designed for signal conditioning applications. It operates at a frequency of 1.6 GHz with an impedance of 200 Ohms. The component is housed in a compact 0805 surface-mount package, suitable for automated assembly processes. It complies with RoHS3 standards and supports lead-free manufacturing requirements.

Balun Feature Summary

• Multi-layer hybrid construction for balanced-to-unbalanced signal conversion
• Compact 0805 surface-mount design for space-constrained PCB layouts
• RoHS3 compliant lead-free manufacturing process

Balun Applications

• RF signal conditioning circuits
• Wireless communication modules
• Balanced antenna interface networks

Balun Procurement Notes

Verify the specific suffix C-001 against official Murata documentation to confirm exact electrical tolerances and packaging specifications. Ensure compatibility with existing RF layout guidelines. Confirm current availability status through authorized distributors as supply conditions may vary.

Balun Selection Notes

Select this component when a 200 Ohm impedance transformation is required at 1.6 GHz. The 0805 footprint offers a balance between performance and board space efficiency. Verify that the operating environment does not exceed standard commercial temperature ranges without derating considerations.

Balun Part Context

This part belongs to the LDB series of hybrid baluns from Murata Electronics. These components are engineered for high-frequency signal integrity in modern electronic devices. The series provides reliable impedance matching solutions for various RF front-end architectures.

Balun Replacement Considerations

The LDB211G5020C-001 is a related variant within the same product family but features a different impedance rating. Cross-referencing datasheets is essential to ensure functional equivalence before substitution.