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LP2996MX is listed in the Special Purpose Regulators range at ChipApex. The manufacturer field lists National Semiconductor. Its product description is TERMINATOR SUPPORT CIRCUIT. Review the specifications below when checking this part for your BOM.
The LP2996MX is a specialized power management integrated circuit (PMIC) manufactured by Texas Instruments, designed specifically for DDR termination applications. It functions as a high-current linear regulator capable of delivering up to 1.5 A of output current. The device operates within an input voltage range of 1.8 V to 5.5 V and provides a maximum adjustable output voltage of 900 mV. Key electrical specifications include a quiescent input current of 320 uA. The component is housed in an SOIC-8 surface-mount package and supports operation across a temperature range from 0°C to +125°C.
Verify the manufacturer designation carefully, as National Semiconductor was acquired by Texas Instruments. Ensure the specific suffix matches the required package type and environmental compliance standards. Confirm availability status, as older part numbers may have limited stock or be subject to obsolescence notices. Cross-reference the datasheet revision to ensure compatibility with current design requirements.
Select this component when designing systems requiring precise low-voltage regulation for DDR memory interfaces. Consider the thermal performance of the SOIC-8 package under full load conditions. Evaluate the input voltage headroom relative to the system's power rail to ensure stable linear regulation. Verify that the 1.5 A current capability aligns with the peak demand of the target memory configuration.
This part belongs to the LP2996 series of DDR termination regulators. It is functionally related to variants such as the LP2996MRX, which utilizes an HSOP-8 PowerPAD package for improved thermal dissipation. The MX suffix typically denotes the standard SOIC-8 plastic package variant within the product family.
The LP2996MRX/NOPB is a documented alternative offering similar electrical characteristics but in an HSOP-8 PowerPAD package. Designers must account for differences in thermal resistance and physical footprint when substituting between these package types.
Explore related parts through Power Management (PMIC), Integrated Circuits (ICs), all product categories, ChipApex homepage.

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