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LTC2337HMS-18#TRPBF is listed in the Analog To Digital Converters (ADC) range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC ADC 18BIT SAR 16MSOP. Review the specifications below when checking this part for your BOM.
The LTC2337HMS-18#TRPBF is an 18-bit successive approximation register (SAR) analog-to-digital converter manufactured by Analog Devices Inc. It operates from a single 5V supply and features fully differential inputs with a true bipolar range of ±10.24V. The device achieves a throughput rate of 500ksps with no pipeline delay or cycle latency. Key electrical specifications include a maximum integral nonlinearity (INL) of ±4LSB, guaranteed 18-bit resolution without missing codes, and a typical signal-to-noise ratio (SNR) of 100dB at a 2kHz input frequency. Power consumption is typically 35mW at full sampling rate, scaling down to 300μW in sleep mode.
Verify the ordering suffix #TRPBF confirms tape and reel packaging for this specific part number. Confirm the H-grade designation indicates an extended operating temperature range of –40°C to 125°C. Ensure compatibility with the required 16-lead MSOP package format for your PCB layout.
Select this component when high voltage differential inputs up to ±10.24V are required without external attenuation circuitry. The internal reference buffer simplifies design by providing a 4.096V output for the specified input range. Consider the 35mW power dissipation at 500ksps and the availability of nap and sleep modes for power-sensitive applications.
This part belongs to the LTC2337-18 family of low noise, high speed SAR ADCs. The HMS-18 variant specifically denotes the 16-lead plastic MSOP package with an extended industrial temperature range. The #TRPBF suffix indicates lead-free finish and tape and reel shipping configuration.
Direct pin-compatible replacements within the same series include LTC2337IMS-18#TRPBF for commercial temperature range (0°C to 70°C) and LTC2337CMS-18#TRPBF for lower temperature requirements. Verify that the thermal performance of the MSOP package meets the junction temperature limits for the intended application environment.
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