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LTC3869IUFD#PBF is listed in the DC DC Switching Controllers range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC REG CTRLR BUCK 28QFN. Review the specifications below when checking this part for your BOM.
The LTC3869IUFD#PBF is a dual synchronous step-down DC/DC controller manufactured by Analog Devices Inc. It operates within an input voltage range of 2.75V to 18V and supports output voltages from 0.6V to 12.5V with a maximum output current of 30A per channel. The device features a switching frequency adjustable between 450kHz and 550kHz, utilizing a 28-lead QFN package. It includes integrated power MOSFET drivers and offers low quiescent current operation suitable for high-efficiency applications.
Verify the specific suffix #PBF indicates lead-free RoHS compliance before ordering. Confirm the IUFD package variant matches your PCB footprint requirements. Check official distributor channels for current availability as supply status may vary. Ensure compatibility with your system's thermal management design given the QFN package constraints.
Select this controller when dual isolated or non-isolated outputs are required from a single input source. Compare against single-channel alternatives if only one rail is needed to reduce BOM cost. Verify that the external MOSFET selection aligns with the driver capabilities and the target 30A current specification. Consider the 450kHz to 550kHz frequency range for inductor sizing trade-offs.
This component belongs to the LTC3869 family of dual synchronous buck controllers designed for high-current applications. It shares architectural similarities with other members like the LTC3868 but differs in pinout and specific electrical characteristics. The series focuses on providing flexible power delivery solutions for complex multi-rail systems in industrial and telecom environments.
Direct substitutes include the LTC3869IGN-2#PBF which shares identical electrical specifications but utilizes an SSOP-28 package instead of QFN-28. Verify pin-to-pin compatibility and thermal performance differences due to package variation before substitution.
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