M2S025T-FCS325I

Soc System On Chip Overview

The M2S025T-FCS325I is a SmartFusion 2 System-on-Chip FPGA from Microchip Technology, featuring an ARM Cortex-M3 microcontroller subsystem integrated with a 27.6K Logic Element FPGA fabric. It operates within a junction temperature range of -40°C to 100°C and utilizes a 325-pin Fine-Pitch Ball Grid Array (FCSBGA) package. The device supports a DC core supply voltage of 1.14V to 1.26V and includes embedded non-volatile memory for configuration storage.

Soc System On Chip Feature Summary

• Integrates an ARM Cortex-M3 processor running at up to 166 MHz alongside the FPGA fabric
• Provides 27,696 logic elements for complex digital design implementation
• Includes embedded flash memory allowing for instant-on boot capabilities
• Supports industrial operating temperatures ranging from -40°C to +100°C

Soc System On Chip Applications

• Industrial automation controllers requiring real-time processing
• Secure communication gateways utilizing integrated encryption blocks
• Embedded systems needing combined MCU and FPGA functionality
• Automotive electronics operating in high-temperature environments

Soc System On Chip Procurement Notes

Verify that the specific ordering suffix matches the required thermal grade and package variant. Confirm export control classifications if shipping across international borders, as certain FPGA components may require additional documentation. Ensure power supply rails strictly adhere to the recommended operating conditions specified in the datasheet to maintain device reliability.

Soc System On Chip Selection Notes

Select this model when a low-density SoC solution combining an ARM Cortex-M3 core with approximately 27K logic resources is required. The FCS325 package offers a compact footprint suitable for space-constrained designs. Verify that the application's I/O voltage requirements align with the supported MSIO and DDRIO bank standards before finalizing the component choice.

Soc System On Chip Part Context

This component belongs to the SmartFusion 2 family, which merges Flash*Freeze technology with standard FPGA capabilities. Unlike the IGLOO 2 series, SmartFusion 2 devices include a dedicated Microcontroller Subsystem (MSS). This integration allows for hardware-software co-design, reducing system complexity by consolidating control and logic functions onto a single silicon die.

Soc System On Chip Replacement Considerations

Direct pin-compatible replacements within the same density class include the M2S025T-VFG400 or M2S025T-1FG484, though these utilize different package footprints. For higher performance needs, consider the M2S050T series, but verify that the increased logic density and power consumption fit the target board design constraints.