Soc System On Chip M2S050-FCS325 product image

M2S050-FCS325

$79.36
  • Description:IC SOC CORTEX-M3 166MHZ 325BGA
  • Series:SmartFusion®2

SKU:5381a67301f7 Category: Brand:

  
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M2S050-FCS325 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC SOC CORTEX-M3 166MHZ 325BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for M2S050-FCS325

  • Description:IC SOC CORTEX-M3 166MHZ 325BGA
  • Series:SmartFusion®2
  • Mfr:Microchip Technology
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:ARM® Cortex®-M3
  • Flash Size:256KB
  • RAM Size:64KB
  • Peripherals:DDR, PCIe, SERDES
  • Connectivity:CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Speed:166MHz
  • Primary Attributes:FPGA - 50K Logic Modules
  • Operating Temperature:0°C ~ 85°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:325-TFBGA, FCBGA
  • Supplier Device Package:325-FCBGA (11x11)

Soc System On Chip datasheet and documents for M2S050-FCS325

M2S050-FCS325

Soc System On Chip Overview

The M2S050-FCS325 is a SmartFusion 2 System-on-Chip FPGA manufactured by Microchip Technology. It integrates an ARM Cortex-M3 microcontroller subsystem with a 56K logic element FPGA fabric. The device operates at a maximum clock frequency of 166 MHz and includes 256 kB of program memory and 64 kB of data RAM. It features 200 I/O pins housed in a 325-FCBGA package measuring 11x11 mm. Electrical specifications include a core supply voltage (VDD) range of 1.14 V to 1.26 V, with typical operation at 1.2 V.

Soc System On Chip Feature Summary

  • Integrates ARM Cortex-M3 processor with 56K Logic Elements
  • Includes 256 kB Flash and 64 kB SRAM
  • Supports DDR, PCIe, and SERDES peripherals
  • Operates within 0°C to 85°C commercial temperature range

Soc System On Chip Applications

  • Industrial control systems requiring mixed-signal processing
  • Secure embedded applications utilizing flash-based non-volatility
  • Communication interfaces integrating Ethernet, USB, and CANbus

Soc System On Chip Procurement Notes

Verify the specific speed grade suffix (e.g., -1) against design timing requirements. Confirm RoHS compliance status as datasheets may indicate non-compliance for certain revisions. Ensure thermal management accounts for junction-to-air resistance values provided in the package thermal characteristics table.

Soc System On Chip Selection Notes

Select based on required logic density and I/O count. The FCS325 package offers 200 accessible I/Os. Verify power supply constraints, specifically the 1.2 V core and variable I/O bank voltages. Consider thermal dissipation limits when operating near the maximum junction temperature of 85°C.

Soc System On Chip Part Context

This component belongs to the SmartFusion 2 family, which combines low-power flash FPGA technology with a real-time microcontroller subsystem. It is designed for secure, reliable applications where deterministic boot times and hardware-level security are critical. The M2S050 variant provides mid-range capacity within this series.

Soc System On Chip Replacement Considerations

Direct pin-compatible replacements within the same package exist within the M2S050 series, such as M2S050T or M2S050TS variants, depending on required security density and temperature grades. Cross-family migration to IGLOO 2 requires architectural adaptation.

M2S050-FCS325M2S050-FCS325
$79.36
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