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M2S090-FCS325 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC SOC CORTEX-M3 166MHZ 325BGA. Review the specifications below when checking this part for your BOM.
The M2S090-FCS325 is a SmartFusion2 System-on-Chip FPGA from Microchip Technology, integrating an ARM Cortex-M3 processor with a 4-input LookUp Table-based FPGA fabric. It features approximately 86K logic elements and 180 I/Os in a 325-ball FCBGA package. The device operates at a maximum clock frequency of 166 MHz with a typical core supply voltage of 1.2 V. It includes 512 kB of program memory and 64 kB of data RAM. Commercial grade operation is supported within a junction temperature range of 0 °C to 85 °C.
Verify the specific suffix against official datasheets to confirm temperature grade and security density. Confirm export compliance requirements as this product may require additional documentation for international shipping. Check current manufacturing status and lead times directly with authorized distributors or Microchip Technology.
Select the commercial grade variant for applications operating between 0 °C and 85 °C. Ensure power supply rails meet the recommended operating conditions, specifically VDD at 1.2 V nominal. Verify that the 325-ball FCBGA package fits the PCB footprint constraints. Consider thermal resistance values when designing heat dissipation strategies for high-load scenarios.
This component belongs to the SmartFusion2 family, which combines flash-based FPGA technology with an integrated microcontroller subsystem. It is designed for applications requiring both deterministic real-time control and reconfigurable logic on a single chip. The family offers varying densities up to 150K logic elements across different package options.
Compatible alternatives within the same ecosystem include other densities in the SmartFusion2 series such as M2S050 or M2S150 variants. For pure FPGA needs without the MCU, the IGLOO2 family (e.g., M2GL090) provides similar logic densities. Cross-family migration requires verification of pin compatibility and software toolchain adjustments.
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