M2S090-FGG484I

Soc System On Chip Overview

The M2S090-FGG484I is a SmartFusion 2 System-on-Chip FPGA from Microchip Technology, featuring an ARM Cortex-M3 microcontroller subsystem integrated with a 90K logic element FPGA fabric. It utilizes low-power flash technology for non-volatile configuration and includes embedded memory blocks, high-speed SerDes interfaces, and hard DDR3 controllers. The device supports industrial operating temperatures ranging from -40°C to +100°C and is housed in a 484-ball FBGA package.

Soc System On Chip Feature Summary

• Integrates ARM Cortex-M3 processor with 90K Logic Elements
• Industrial temperature grade (-40°C to +100°C)
• Low-power flash-based architecture with embedded security features
• Supports up to 16 SerDes lanes and PCIe Gen 2 endpoints

Soc System On Chip Applications

• Secure industrial automation control systems
• Aerospace and defense communication platforms
• Medical imaging equipment signal processing
• Automotive infotainment and gateway applications

Soc System On Chip Procurement Notes

Verify the specific suffix 'FGG484I' corresponds to the industrial temperature grade and 484-ball FBGA package. Confirm RoHS compliance status as indicated in official documentation. Ensure ESD handling protocols are followed during procurement and storage due to moisture sensitivity classification.

Soc System On Chip Selection Notes

Select this model when industrial temperature stability (-40°C to +100°C) is required alongside significant FPGA logic density (90K LEs). Compare against commercial grade variants if lower cost is prioritized over extended temperature range. Verify power supply requirements for VDD (1.14V-1.26V) and VPP (3.15V-3.45V) match system design constraints.

Soc System On Chip Part Context

This component belongs to the SmartFusion 2 family, which combines MCU and FPGA capabilities on a single die. It shares architectural similarities with IGLOO 2 FPGAs but adds the MSS peripheral set. The 'M2S' prefix denotes SmartFusion 2, while '090' indicates the 90K logic element density tier within the product line.

Soc System On Chip Replacement Considerations

Direct pin-compatible replacements within the same package may include other densities in the SmartFusion 2 series such as M2S050 or M2S150 variants, provided logic resource requirements align. Cross-family migration to IGLOO 2 requires re-evaluation of the microcontroller subsystem absence.