M36L0R7050T4ZSPE

Memory IC Overview

The M36L0R7050T4ZSPE is a multichip package (MCP) memory circuit manufactured by Micron Technology Inc. It integrates flash memory and pseudo-static random-access memory (PSRAM) into a single component. The device is classified as an IC Flash PSRAM with a total capacity of 160 megabits. This integrated solution combines non-volatile storage capabilities with volatile high-speed memory functions within a compact form factor designed for embedded applications requiring both code storage and data processing memory.

Memory IC Feature Summary

• Integrates flash memory and PSRAM in a single multichip package
• Provides combined non-volatile and volatile memory solutions
• Designed for embedded system applications

Memory IC Applications

• Embedded systems requiring integrated code and data storage
• Devices needing compact memory solutions with mixed memory types
• Applications utilizing Micron's MCP technology for space-constrained designs

Memory IC Procurement Notes

Verify the obsolete status of this part number directly with Micron Technology Inc. or authorized distributors before procurement planning. Confirm availability through official channels as stock levels may be limited. Ensure that any substitute components meet the specific electrical and physical requirements of the original design to maintain system compatibility and performance standards.

Memory IC Selection Notes

Select this component when a design requires a single package solution for both persistent storage and high-speed volatile memory. Consider the 160-megabit capacity and the specific integration of flash and PSRAM technologies. Evaluate the physical dimensions and pinout compatibility with the target printed circuit board layout to ensure proper integration into the final electronic assembly.

Memory IC Part Context

This part belongs to Micron's family of multichip packages that combine different memory technologies. Such MCPs are engineered to reduce board space and simplify assembly processes by integrating multiple dies into one package. The M36L0R7050T4ZSPE specifically addresses needs for compact, efficient memory architectures in consumer and industrial electronics where space is at a premium.