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M50-3630842R is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Harwin Inc.. Its product description is CONN HEADER SMD 8POS 1.27MM. Review the specifications below when checking this part for your BOM.
The Harwin M50-3630842R is a single-row, 1.27mm pitch male pin header designed for surface mount technology (SMT) applications. It features eight contacts arranged in a straight configuration with a vertical orientation relative to the board. The connector utilizes a gold finish on the contact area and tin plating elsewhere, ensuring reliable electrical performance. With a mating pin height of 3mm, it supports robust board-to-board connections in compact electronic assemblies.
Verify the specific suffix 'R' indicates reel packaging when sourcing from distributors. Confirm that the component matches the 1.27mm pitch requirement for your PCB footprint. Ensure the gold contact finish specification aligns with your environmental durability needs. Cross-reference the datasheet for reflow soldering profile limits to prevent thermal damage during manufacturing.
Select this part only if a single-row, vertical SMT header is required. The 1.27mm pitch dictates compatible mating connectors and PCB trace spacing. Verify that the 3mm mating pin height fits within your enclosure constraints. Consider the gold contact finish for corrosion resistance in demanding environments compared to tin-only alternatives.
This component belongs to the Harwin ARCHER M50 series, which focuses on high-reliability interconnect solutions. The series offers various configurations including jumper sockets and shunts. The M50-3630842R specifically addresses the need for small-footprint, high-density connections in modern electronic devices where space is limited.
Direct substitutes must match the 1.27mm pitch, 8-position count, and SMT vertical form factor. Verify that any alternative maintains the same gold contact finish and 3mm mating height. Check for identical mechanical locking features and PCB footprint dimensions to ensure seamless integration without redesign.
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