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M55-7002642R is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Harwin Inc.. Its product description is CONN HEADER SMD 26POS 1.27MM. Review the specifications below when checking this part for your BOM.
The Harwin M55-7002642R is a surface-mount board-to-board header connector from the Archer Kontrol series. It features 26 positions arranged in two rows with a 1.27mm pitch. The connector utilizes phosphor bronze contacts with gold plating and an LCP housing rated UL94 V-0. Rated for 1.2A at 100VAC, it operates within a temperature range of -55°C to 125°C. Designed for vertical SMD installation, it offers stacking heights of 8.25mm, 11.1mm, or 13.9mm depending on configuration.
Verify the specific part number suffix against official Harwin documentation to confirm pin count, row configuration, and termination style. Ensure compatibility with existing PCB footprint dimensions and reflow soldering profiles. Cross-reference the manufacturer's latest datasheet to confirm current availability and any potential design changes before final procurement.
Select this component when a 1.27mm pitch vertical header is required for space-constrained applications. Consider the 1.2A current rating and 100VAC voltage limit for circuit requirements. Evaluate the available stacking heights to ensure proper clearance between stacked boards. Confirm that the surface-mount package aligns with the manufacturing process capabilities.
This connector belongs to the Harwin Archer Kontrol family, known for high-density interconnect solutions. The M55 series specifically targets demanding environments requiring reliable board-to-board connections. Similar variants exist with different position counts and row configurations within the same architectural framework.
Direct substitutes include other Harwin M55 series headers with matching 1.27mm pitch and 26-position layout. Verify mechanical dimensions and electrical ratings before substitution. Alternative manufacturers may offer compatible parts but require thorough validation of contact geometry and thermal performance.
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