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MAX2771ETI+T is listed in the RF Receivers range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is RF RX GNSS 1.227/1.575GHZ 28TQFN. Review the specifications below when checking this part for your BOM.
The MAX2771ETI+T is a highly integrated, multi-constellation and multi-band Global Navigation Satellite System (GNSS) receiver designed for modern satellite navigation applications. It supports frequencies including 1.2276 GHz and 1.57542 GHz, covering E5/L5, L2, E6, and E1/L1 bands. The device operates on a supply voltage of 2.7 V to 3.3 V with a maximum current consumption of 27 mA. It features configurable bandwidths of 2.5 MHz, 4.2 MHz, 8.7 MHz, 16.4 MHz, 23.4 MHz, and 36 MHz. Key performance metrics include a gain of 96 dB and a noise figure of 10.3 dB. The component is housed in a 28-WFQFN exposed pad package measuring 5 mm x 5 mm and functions within an operating temperature range of -40°C to +85°C.
Verify the specific suffix 'T' indicates tape-and-reel packaging when sourcing. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Ensure the supplier provides valid traceability for the Analog Devices/Maxim Integrated part number. Cross-reference the datasheet revision date to ensure compatibility with current design requirements.
Select this component for designs requiring support for multiple GNSS signal bands without external mixers. Consider the 28-WFQFN package size for space-constrained PCB layouts. Evaluate the 27 mA current consumption against battery life requirements. Verify that the required bandwidth settings align with the intended signal processing architecture.
This part belongs to the MAX2771 series of next-generation GNSS receivers from Analog Devices/Maxim Integrated. It serves as a direct replacement for previous generation single-band or dual-band receivers in modern navigation systems. The device simplifies RF front-end design by integrating necessary amplification and downconversion stages into a single silicon die.
Public confirmed substitute part numbers are not available in the provided source material.
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