MB30H90CTHE3_A/P

Diode Arrays Overview

The MB30H90CTHE3_A/P is a Schottky diode array manufactured by Vishay General Semiconductor. It features a dual common cathode configuration housed in a TO-263AB surface mount package. The device is rated for a maximum repetitive peak reverse voltage of 90 V and an average forward rectified current of 15 A per element. It complies with RoHS standards and is lead-free.

Diode Arrays Feature Summary

• Schottky barrier technology ensures low forward voltage drop and minimal power loss during operation.
• Common cathode arrangement simplifies circuit design for dual-channel applications.
• Surface mount construction facilitates automated assembly and compact board layouts.

Diode Arrays Applications

• High-frequency switching power supplies
• Free-wheeling rectification in DC-DC converters
• Polarity protection circuits

Diode Arrays Procurement Notes

Verify the specific suffix 'A/P' against the manufacturer's official documentation to confirm package type and availability status, as suffixes often denote distinct manufacturing or packaging variations. Ensure compliance requirements match project specifications before procurement.

Diode Arrays Selection Notes

Select this component when a low-loss, high-current Schottky solution is required in a surface-mount form factor. Evaluate thermal management capabilities relative to the TO-263AB package constraints and ensure the 90 V reverse voltage rating exceeds the circuit's peak operating voltage.

Diode Arrays Part Context

This part belongs to Vishay's MB30H series of high-efficiency Schottky rectifiers. These devices are engineered for applications demanding superior switching performance and reduced heat generation compared to standard silicon rectifiers, utilizing advanced semiconductor processing techniques.

Diode Arrays Replacement Considerations

Consult the official Vishay datasheet for direct pin-compatible substitutes within the same series. Verify that any alternative maintains identical electrical ratings and package dimensions to ensure seamless integration without redesigning the PCB footprint.