MBR20200CTE3/TU

Diode Arrays Overview

The MBR20200CTE3/TU is a dual common cathode Schottky rectifier manufactured by Microchip Technology. It utilizes silicon technology and is housed in a TO-220AB-3 through-hole package. The device supports a maximum continuous forward current of 20 A and a repetitive peak reverse voltage of 200 V. Key electrical parameters include a maximum forward voltage of 1 V, a non-repetitive peak forward surge current of 150 A, and a maximum reverse current of 1 A. The component operates within a temperature range of -65 °C to +175 °C.

Diode Arrays Feature Summary

• Dual common cathode configuration for efficient power conversion
• Low forward voltage drop characteristics
• High thermal stability with elevated junction temperature rating

Diode Arrays Applications

• DC-DC converters
• Free-wheeling diodes in inductive load circuits
• Power supply output rectification

Diode Arrays Procurement Notes

Verify the specific suffix TU against official Microchip documentation to confirm lead-free compliance and packaging details. Confirm availability status as distribution channels may vary. Ensure the procurement source provides valid traceability and authenticity guarantees for electronic components.

Diode Arrays Selection Notes

Select this component when a dual Schottky rectifier with 200 V blocking capability and 20 A current handling is required. The TO-220AB package facilitates effective heat dissipation for through-hole mounting. Verify that the 1 V forward voltage meets the efficiency requirements of the target circuit design.

Diode Arrays Part Context

This part belongs to the MBR series of Schottky rectifiers from Microchip Technology. It shares the TO-220AB form factor with other variants in the lineup but differs in voltage and current ratings. The e3 designation indicates lead-free construction compliant with RoHS standards.

Diode Arrays Replacement Considerations

Cross-reference with MBR20H200CTE3 or MBRF20200CTG for potential functional equivalents. Verify pinout compatibility and thermal performance before substitution.