MBR40020CT

Diode Arrays Overview

The GeneSiC Semiconductor MBR40020CT is a silicon power Schottky diode module designed for high-current applications. It features a Twin Tower package with screw mount installation. The device supports an average forward current of 400 A per package and offers a repetitive peak reverse voltage of 20 V. Key electrical parameters include a maximum forward voltage of 0.70 V at Tj = 150 °C and a thermal resistance junction-case of 0.35 °C/W per leg. The module operates within a temperature range of -55 °C to +150 °C.

Diode Arrays Feature Summary

• High surge capability with peak forward surge current of 3000 A
• ESD sensitive design not required
• Twin Tower package configuration

Diode Arrays Applications

• DC-DC converters
• Free-wheeling rectification in motor drives
• Power supply output rectification

Diode Arrays Procurement Notes

Verify the specific part number suffix against official documentation, as variations may exist. Confirm thermal interface requirements and mounting torque specifications prior to integration. Ensure compatibility with existing heatsink designs given the Twin Tower package dimensions. Cross-reference datasheet revisions to confirm parameter stability.

Diode Arrays Selection Notes

Select this component for applications requiring high average current handling and low forward voltage drop at elevated temperatures. The 20 V rating suits low-voltage DC bus applications. Evaluate thermal management needs based on the 0.35 °C/W junction-case resistance. Consider the 3000 A surge capability for inrush protection scenarios.

Diode Arrays Part Context

This module belongs to the MBR400 series of silicon power Schottky diodes from GeneSiC Semiconductor. The series includes variants with different reverse voltage ratings, such as the MBR40030CT and MBR40040CT, sharing similar current and thermal characteristics. These modules are engineered for robust performance in industrial power conversion systems.

Diode Arrays Replacement Considerations

Direct replacements must match the 400 A current rating, 20 V reverse voltage, and Twin Tower package. Verify that substitute components maintain equivalent thermal resistance and surge current capabilities to ensure system reliability without redesign.