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MCA2255G is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISO 5.3KV DARL W/BASE 6-DIP. Review the specifications below when checking this part for your BOM.
The MCA2255G is a single-channel optoisolator manufactured by Isocom Components 2004 LTD. It features a Darlington transistor output configuration with an accessible base terminal, housed in a 6-pin DIP package. The device provides a high isolation voltage rating of 5300Vrms between the input and output circuits. This component is designed for applications requiring robust electrical isolation and signal transmission across potential differences.
Verify the specific datasheet version from Isocom Components to confirm pinout compatibility and absolute maximum ratings before integration. Ensure that thermal management strategies align with the DIP package limitations. Cross-reference the ordering code MCA2255G to distinguish it from surface-mount variants like the SMT&R series, as packaging affects mechanical mounting requirements.
Select this component when high isolation voltage is critical alongside the need for adjustable gain via the base terminal. The Darlington configuration offers higher current transfer ratios compared to standard phototransistors. Consider the 6-DIP form factor for through-hole assembly processes where space constraints allow for larger footprints compared to surface-mount alternatives.
Isocom Components specializes in infrared optoelectronic devices, including optocouplers and sensors. The MCA2255G belongs to their line of general-purpose optoisolators designed for reliable performance in industrial environments. The manufacturer emphasizes durability and consistent optical coupling characteristics across their product portfolio.
Public confirmed substitute part numbers are not available in the provided documentation. Surface-mount equivalents such as the MCA2255SMT&R offer similar electrical characteristics but differ in package type and mounting method.
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