MCC700-16IO1W

SCRs - Modules Overview

The IXYS MCC700-16IO1W is a high-power dual thyristor module designed for industrial applications. It features a water-cooled WC-500 package and supports panel mounting via screw terminals. The device handles a rated average on-state current of 700 A with a peak non-repetitive surge current capability of 28 kA. It offers a repetitive peak off-state voltage of 1600 V and a maximum gate trigger current of 150 mA. The module operates within a junction temperature range of -40°C to +125°C, ensuring reliability in demanding thermal environments.

SCRs - Modules Feature Summary

• High current capacity suitable for heavy-duty power conversion
• Water-cooled design for efficient thermal management
• Robust surge current handling capability

SCRs - Modules Applications

• Industrial motor drives
• High-power rectifier bridges
• DC power supplies

SCRs - Modules Procurement Notes

Verify the specific suffix 'W' indicates the water-cooled variant when sourcing. Confirm the WC-500 package dimensions match your cooling system interface. Check for discontinuation notices as high-power modules may have limited availability or end-of-life status from the manufacturer.

SCRs - Modules Selection Notes

Select this component for applications requiring high continuous current and robust thermal dissipation. Ensure the cooling system can maintain the junction temperature within the specified operating range. Verify that the gate drive circuitry provides sufficient current to meet the 150 mA trigger requirement reliably.

SCRs - Modules Part Context

This part belongs to the IXYS MCC series of silicon controlled rectifier modules. It is engineered for high-performance power electronics where efficiency and durability are critical. The series is widely used in sectors requiring precise control of high-power electrical energy.

SCRs - Modules Replacement Considerations

Direct replacements require matching the 700 A rating, 1600 V blocking voltage, and WC-500 water-cooled package. Verify pinout compatibility and thermal interface specifications before substitution.