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MK 214 X 3 84 G is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Fischer Elektronik. Its product description is Solder and plug pins, D0.5 mm. Review the specifications below when checking this part for your BOM.
The MK 214 X 3 84 G is a male pin header connector manufactured by Fischer Elektronik. It features a through-hole mounting style with a straight orientation, designed for board-to-board or wire-to-board applications. The component provides 84 contact positions arranged in two rows, utilizing a standard 0.100-inch (2.54 mm) pitch. This configuration ensures reliable electrical connectivity within electronic assemblies requiring high-density interconnections.
Verify the specific part number against official Fischer Elektronik documentation to confirm pin count and row configuration. Ensure that the through-hole mounting requirements align with the target printed circuit board layout. Cross-reference technical specifications directly with the manufacturer's datasheet to validate mechanical dimensions and contact material properties before procurement.
Select this component when a high-contact-count header is required for rigid board connections. The 2.54 mm pitch offers standard spacing compatibility with common electronic components. Consider the straight orientation and through-hole method for stable mechanical support in fixed assembly environments where vibration resistance is necessary.
This model belongs to the Fischer Elektronik MK series of male pin headers. These connectors are engineered for robust performance in various electronic applications. The series typically includes multiple variations differing in contact count and row arrangements, allowing designers to choose precise configurations for specific density and space constraints.
Identify compatible substitutes by matching the 2.54 mm pitch, 84-position count, and two-row through-hole format. Verify that alternative manufacturers offer identical mechanical dimensions and contact materials to ensure seamless integration without modifying the existing printed circuit board footprint.
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