MM912F634DV2APR2

Application Specific Microcontrollers Overview

The MM912F634DV2APR2 is an integrated single-package solution combining an HCS12 microcontroller with a SMARTMOS analog control IC. It features a 16-bit S12 CPU, 32 kByte FLASH, and 2.0 kByte RAM. The device includes a LIN 2.1 physical layer interface with an integrated SCI, six high-voltage wake-up inputs (Lx), two protected low-side outputs for inductive loads, and two protected high-side outputs. It operates within a temperature range of -40°C to 105°C and utilizes a 48-pin LQFP package without an exposed pad.

Application Specific Microcontrollers Feature Summary

• Integrated HCS12 MCU with 32 kB Flash and 2 kB RAM
• LIN 2.1 Physical Layer Interface with integrated SCI
• Six High-Voltage Wake-Up Inputs (L0-L5) with ADC capability
• Two Protected Low-Side and Two Protected High-Side Outputs

Application Specific Microcontrollers Applications

• Relay driver applications requiring LIN communication
• Automotive systems utilizing high-voltage input sensing
• Inductive load control circuits with current sense capabilities

Application Specific Microcontrollers Procurement Notes

Verify the 'R2' suffix indicates Tape and Reel packaging as specified in the ordering information table. Confirm the 'AP' suffix corresponds to the 48-PIN LQFP package without an exposed pad. Ensure the analog option matches Option 2 specifications regarding the absence of the current sense module and limited wake-up inputs if required by the design.

Application Specific Microcontrollers Selection Notes

Select this variant when a non-exposed pad LQFP package is preferred over the AE version. The DV2 designation specifies Analog Option 2, which excludes the current sense module and reduces wake-up inputs to L0-L3 compared to Option 1. Verify that the 20 MHz maximum bus frequency meets system timing requirements.

Application Specific Microcontrollers Part Context

This component belongs to the MM912F634 family of integrated relay drivers. The specific part number denotes the DV2 analog configuration, AP package type (non-exposed pad), and R2 tape and reel delivery format. It shares the core HCS12 architecture with other variants like the MM912F634DV1AE but differs in analog peripheral availability.

Application Specific Microcontrollers Replacement Considerations

Direct replacements include MM912F634DV2AE (exposed pad variant) or MM912F634DV1AE/DP (Option 1 with current sense). Package differences require PCB footprint adjustments between AE and AP versions.