MMIC271609T4064C0300

Description：MICROPHONE MEMS ANALOG -38DB
Series：MMIC
Mfr：TDK InvenSense
Package：Bulk

SKU:f0227c4c8e52 Category: Microphones Brand: TDK InvenSense

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Product introduction

MMIC271609T4064C0300 is listed in the Microphones range at ChipApex. The manufacturer field lists TDK InvenSense. Its product description is MICROPHONE MEMS ANALOG -38DB. Review the specifications below when checking this part for your BOM.

Microphones specifications for MMIC271609T4064C0300

Description：MICROPHONE MEMS ANALOG -38DB
Series：MMIC
Mfr：TDK InvenSense
Package：Bulk
Type：MEMS (Silicon)
Output Type：Analog
Direction：-
Frequency Range：-
Sensitivity：-38dB ±3dB @ 94dB SPL
S/N Ratio：61.5dB
Impedance：400 Ohms
Voltage Range：-
Current - Supply：90 µA
Port Location：Bottom
Ratings：-
Termination：Solder Pads
Size / Dimension：0.108" L x 0.073" W (2.75mm x 1.85mm)
Height (Max)：0.039" (1.00mm)
Shape：Rectangular
Grade：-
Qualification：-
Voltage - Rated：-

Microphones datasheet and documents for MMIC271609T4064C0300

MMIC271609T4064C0300

Microphones Overview

The MMIC271609T4064C0300 is an analog MEMS microphone manufactured by TDK InvenSense. It features a sensitivity of -38dB ±3dB @ 94dB SPL. The component utilizes solder pads for surface mount assembly, designed for compact audio capture applications within consumer electronics.

Microphones Feature Summary

Analog MEMS silicon construction
Solder pad termination for PCB mounting

Microphones Applications

Compact audio capture
Consumer electronics devices

Microphones Procurement Notes

Verify the specific suffix configuration against official TDK InvenSense documentation to ensure compatibility with target design requirements. Confirm package dimensions and soldering profiles prior to integration. Cross-reference part numbers with authorized distributors to avoid counterfeit components.

Microphones Selection Notes

Select this model for applications requiring analog output signals from a miniature MEMS sensor. Evaluate system noise floors against the specified sensitivity range. Ensure power supply constraints align with the device's operational requirements for optimal signal-to-noise performance.

Microphones Part Context

This component belongs to the TDK InvenSense portfolio of MEMS sensors, which includes motion and audio sensing solutions. The company integrates these technologies for contextual awareness in consumer, automotive, and industrial sectors, leveraging extensive experience in silicon micro-electromechanical systems.