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MMSZ5226BS_R1_00001 is listed in the Single Zener Diodes range at ChipApex. The manufacturer field lists Panjit International Inc.. Its product description is DIODE ZENER 3.3V 200MW SOD323. Review the specifications below when checking this part for your BOM.
The MMSZ5226BS_R1_00001 is a surface mount silicon Zener diode from the MMSZ5221BS series manufactured by Panjit. It features a nominal Zener voltage of 3.3 V with a tolerance range of 3.14 V to 3.47 V. The device operates at a test current of 20.0 mA and dissipates up to 200 mW of power. Key electrical characteristics include a maximum Zener impedance of 28 Ω and a maximum reverse leakage current of 25 μA at 1.0 V. It utilizes an SOD-323 package and supports an operating junction temperature range from -55°C to +150°C.
Verify the specific ordering suffix against official Panjit documentation to confirm packaging details, as suffixes may indicate variations in reel size or tape specifications. Ensure compliance requirements match project needs, specifically checking for RoHS 2.0 and halogen-free status. Confirm the marking code D1 corresponds to the intended inventory tracking and identification protocols within your supply chain.
Select this component when a 3.3 V reference is required in a compact SOD-323 footprint. The 200 mW power rating suits low-power signal conditioning tasks. Verify that the 28 Ω impedance meets circuit sensitivity requirements. Consider the -55°C to +150°C operating range for environmental robustness. Compare leakage current limits against strict low-power standby designs.
This part belongs to the MMSZ5221BS ~ MMSZ5267BS series of surface mount silicon Zener diodes. The series covers voltages from 2.4 V to 75 V with a consistent 200 mW power dissipation capability. All devices share the SOD-323 plastic molded case and planar die technology. The series is designed for high-volume automated assembly in consumer and industrial electronics.
Cross-reference other manufacturers' SOD-323 Zener diodes rated for 3.3 V and 200 mW. Verify pinout compatibility and physical dimensions. Check if alternative parts meet the same 28 Ω impedance and 25 μA leakage specifications. Ensure thermal derating curves align with application constraints.
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