Memory IC MT29C1G12MAAJYAMD-5 IT TR product image

MT29C1G12MAAJYAMD-5 IT TR

  • Description:IC FLASH RAM 1GBIT PAR 130VFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR)

SKU:9eb053c092a3 Category: Brand:

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MT29C1G12MAAJYAMD-5 IT TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC FLASH RAM 1GBIT PAR 130VFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT29C1G12MAAJYAMD-5 IT TR

  • Description:IC FLASH RAM 1GBIT PAR 130VFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile, Volatile
  • Memory Format:FLASH, RAM
  • Technology:FLASH - NAND, Mobile LPDRAM
  • Memory Size:1Gbit (NAND), 512Mbit (LPDRAM)
  • Memory Organization:128M x 8 (NAND), 16M x 32 (LPDRAM)
  • Memory Interface:Parallel
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.95V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:130-VFBGA
  • Supplier Device Package:130-VFBGA (8x9)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MT29C1G12MAAJYAMD-5 IT TR

MT29C1G12MAAJYAMD-5 IT TR

Memory IC Overview

The MT29C1G12MAAJYAMD-5 IT TR is a multichip package (MCP) from Micron Technology, integrating NAND Flash and Mobile LPDDR1 memory. It contains 1 Gbit of SLC NAND Flash and 512 Mbit of LPDDR1 DRAM. The device utilizes a parallel interface with a maximum clock frequency of 200 MHz. It operates within a voltage range of 1.7 V to 1.95 V and supports an industrial temperature range of -40°C to +85°C. The component is housed in a 130-pin VFBGA package designed for surface mount technology.

Memory IC Feature Summary

  • Integrates single-level cell NAND flash and mobile low-power double data rate one memory into a single multichip package.
  • Supports parallel interface operation with asynchronous timing capabilities.
  • Designed for industrial temperature environments with extended thermal stability.

Memory IC Applications

  • Mobile communication devices requiring combined storage and working memory
  • Embedded systems utilizing multichip package architectures
  • Industrial control applications operating in wide temperature ranges

Memory IC Procurement Notes

Verify the current lifecycle status directly with Micron Technology or authorized distributors, as this part number may be obsolete. Confirm moisture sensitivity handling requirements prior to assembly. Ensure compatibility with existing board designs regarding the 130-VFBGA footprint and electrical specifications before procurement.

Memory IC Selection Notes

Select this component when a compact solution combining non-volatile storage and volatile memory is required for space-constrained designs. Verify that the parallel interface and 200 MHz speed meet system timing requirements. Consider the industrial temperature rating if the application environment exceeds standard commercial limits.

Memory IC Part Context

This part belongs to the MT29C series of multichip packages from Micron. These components are engineered to reduce board space by consolidating distinct memory technologies. The specific model integrates SLC NAND for data retention and LPDDR1 for high-speed processing support.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Consult Micron Technology for current alternative recommendations or updated product line replacements for this obsolete component.

MT29C1G12MAAJYAMD-5 IT TRMT29C1G12MAAJYAMD-5 IT TR

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