MT29C2G24MAAAAHAMD-5 IT

Memory IC Overview

The MT29C2G24MAAAAHAMD-5 IT is a 152-ball Package-on-Package (PoP) Multichip Package (MCP) from Micron's MT29C family, designed for mobile applications. It integrates a 2Gb NAND Flash and a 1Gb Mobile LPDRAM. The device operates within an industrial temperature range of –40°C to +85°C with supply voltages between 1.70V and 1.95V. Key specifications include a 2112-byte page size for the x8 NAND interface and support for Partial-Array Self Refresh (PASR) in the DRAM component.

Memory IC Feature Summary

• Combines NAND Flash and Mobile LPDRAM in a space-saving PoP architecture
• Features separate interfaces for optimized processor connectivity
• Supports low-voltage operation compatible with 1.8V LVCMOS inputs
• Includes programmable burst lengths and deep power-down modes

Memory IC Applications

• Mobile devices requiring high-performance memory solutions
• TI OMAP-based system designs
• Embedded systems needing combined storage and working memory

Memory IC Procurement Notes

Verify current production status directly with Micron Technology or authorized distributors, as availability may vary. Confirm that the specific ordering suffix matches the required package code and operational parameters. Ensure compliance with RoHS standards and check for any engineering sample restrictions if applicable to your procurement channel.

Memory IC Selection Notes

Select this MCP for designs targeting TI OMAP processors where board space is limited. Ensure the host system supports the separate NAND and LPDDR bus architectures. Verify that the operating voltage range of 1.70V to 1.95V aligns with the system power rails. Consider the industrial temperature rating for environments subject to wider thermal variations.

Memory IC Part Context

This component belongs to the MT29C family of NAND and LPDRAM MCPs. It utilizes a 152-ball VFBGA or TFBGA package structure. The part number indicates a 2Gb NAND density paired with 1Gb LPDRAM density. It is distinct from other densities in the series such as 1Gb or 4Gb NAND variants.

Memory IC Replacement Considerations

Consult the manufacturer's documentation for equivalent parts within the MT29C family. Verify pin compatibility and electrical specifications before substituting with other 152-ball PoP configurations.