MT29C4G96MAZAPCMJ-5 IT

Memory IC Overview

The MT29C4G96MAZAPCMJ-5 IT is a 152-ball Package-on-Package (PoP) Multi-Chip Package (MCP) from the Micron MT29C family, designed for mobile applications. It integrates a 4Gb NAND Flash and a 4Gb Mobile LPDRAM in a single space-saving assembly. The device operates at a supply voltage of 1.70V to 1.95V and supports an industrial temperature range of –40°C to +85°C. The NAND Flash features separate interfaces with x8 or x16 data widths, while the Mobile LPDRAM provides low-power memory capabilities.

Memory IC Feature Summary

• Combines NAND Flash and Mobile LPDRAM in a single PoP MCP structure
• Features separate NAND Flash and Mobile LPDRAM interfaces without shared buses
• Supports low-voltage operation within the 1.70V to 1.95V range
• Includes Mobile LPDRAM features such as partial-array self refresh and deep power-down mode

Memory IC Applications

• Mobile devices requiring low-power and high-performance memory solutions
• Designs targeting minimal package footprint requirements
• Processors utilizing separate NAND Flash and Mobile LPDRAM buses

Memory IC Procurement Notes

Verify the specific NAND width (x8 or x16) and LPDRAM configuration against the required system bus architecture. Confirm the package code matches the PCB design, as variations exist between VFBGA and TFBGA types. Ensure the industrial temperature rating aligns with the operational environment. Check current production status as specifications are subject to change.

Memory IC Selection Notes

Select this component when a compact solution integrating both non-volatile storage and volatile memory is required. The separate interface architecture allows optimized connection to processors with distinct memory buses. Consider the available package dimensions and ball assignments to ensure compatibility with the target board layout and thermal management strategy.

Memory IC Part Context

This part belongs to the Micron MT29C family of NAND Flash and Mobile LPDRAM combinations. These products are specifically engineered for mobile applications where power efficiency and physical size are critical constraints. The PoP technology stacks the memory dies to reduce the overall footprint compared to discrete components.

Memory IC Replacement Considerations

Consult the manufacturer's documentation for alternative part numbers within the MT29C family that match the required density and interface configurations. Verify compatibility with existing board designs before substituting.