MT29F1G08ABAFAH4-AAT:F

Memory IC Overview

The MT29F1G08ABAFAH4-AAT:F is a 1 Gbit SLC NAND flash memory device manufactured by Micron Technology. It features an asynchronous parallel interface with an 8-bit data bus width and a storage organization of 128M x 8. The component operates within a supply voltage range of 1.7 V to 1.95 V, with a maximum power current of 35 mA. It is housed in a 63-ball VFBGA package designed for surface mount technology. The device supports an industrial temperature range from -40°C to +105°C.

Memory IC Feature Summary

• SLC architecture providing high reliability and endurance
• Asynchronous parallel interface for direct system integration
• Wide operating temperature range suitable for industrial environments

Memory IC Applications

• Industrial control systems requiring robust non-volatile storage
• Automotive electronics demanding high durability
• Embedded applications needing reliable data retention

Memory IC Procurement Notes

Verify the specific suffix 'AAT:F' against official Micron documentation to confirm exact packaging and qualification status. Ensure compatibility with 1.7V-1.95V power domains. Confirm lead times as availability may vary due to manufacturing cycles. Check RoHS compliance details in the latest datasheet revision.

Memory IC Selection Notes

Select this part when a 1 Gbit capacity with 8-bit parallel access is required. It is suitable for designs constrained by the 63-VFBGA footprint. Consider the 1.8V nominal voltage requirement versus standard 3.3V systems. Evaluate thermal management needs for the -40°C to +105°C operational range.

Memory IC Part Context

This component belongs to the Micron MT29F series of NAND flash memories. It shares architectural similarities with other devices in the family but differs in density and package options. The 1 Gbit variant offers a balance between storage capacity and interface simplicity for embedded controllers.

Memory IC Replacement Considerations

Check for pin-compatible upgrades within the MT29F series, such as higher density variants like the MT29F2G08 or MT29F4G08, if increased storage is needed. Verify that alternative packages (e.g., TSOP) do not require board redesign.