MT29F1G16ABBDAHC:D

Memory IC Overview

The MT29F1G16ABBDAHC:D is a Micron NAND flash memory component with a 1 Gbit capacity and SLC technology. It features a 64M x 16 organization and parallel interface in a 63-ball FBGA package. The device supports asynchronous timing with VCC operating at 1.7V to 1.95V. It has an extended temperature range of -40°C to +85°C. The product is currently marked as End-of-Life (EOL) by the manufacturer.

Memory IC Feature Summary

• Supports Open NAND Flash Interface (ONFI) 1.0 standard for controller interoperability
• Utilizes Single-Level Cell (SLC) architecture for high endurance and reliability
• Includes hardware Ready/Busy# signal for operation status monitoring
• Provides internal data movement capabilities for optimized performance

Memory IC Applications

• Industrial control systems requiring robust data retention
• Automotive embedded storage solutions
• Consumer electronics firmware storage
• Network infrastructure equipment

Memory IC Procurement Notes

This component is officially designated as End-of-Life (EOL) by Micron Technology Inc. Procurement should be limited to existing stock or last-time buys, as future manufacturing support is discontinued. Verify specific lot dates and authenticity through authorized channels due to potential market availability from third-party distributors. Ensure compatibility with legacy system designs before acquisition.

Memory IC Selection Notes

Select this part only for designs compatible with ONFI 1.0 specifications and 16-bit parallel interfaces. Consider the EOL status when planning long-term production lifecycles. Evaluate alternative newer generation parts if future supply continuity is required. Confirm voltage levels match the 1.7V to 1.95V requirement strictly.

Memory IC Part Context

Part of the Micron MT29F series, designed for high-reliability applications using SLC technology. This specific model offers 1 Gbit density in a compact FBGA form factor. It serves as a legacy solution for systems requiring proven NAND flash stability without advanced multi-level cell complexities.

Memory IC Replacement Considerations

No verified public substitute part numbers are available in the provided documentation. Consult Micron directly for current portfolio alternatives that meet similar electrical and mechanical requirements.