MT29F8G08BAAWP:A TR

Memory IC Overview

The Micron MT29F8G08BAAWP:A TR is an 8Gb x8 Single-Level Cell (SLC) NAND Flash memory device. It features a parallel interface with a page size of 2,112 bytes and a block size of 64 pages. The device operates within a voltage range of 2.7V to 3.6V and is housed in a 48-pin TSOP Type I package. It supports asynchronous timing and includes advanced command sets such as Page Read Cache Mode and Two-Plane operations.

Memory IC Feature Summary

• Single-level cell technology for high endurance and data retention
• Supports two-plane and interleaved die operations for improved throughput
• Includes internal data move capabilities within the read plane
• Provides hardware ready/busy signaling and software status monitoring

Memory IC Applications

• Embedded storage systems requiring SLC reliability
• Industrial control applications needing extended temperature ranges
• Consumer electronics utilizing parallel NAND interfaces
• Automotive infotainment and telematics modules

Memory IC Procurement Notes

Verify the specific ordering suffix against official Micron parametric databases to confirm valid combinations of density, package, and feature set. Ensure compatibility with existing system voltage levels and interface timing requirements before integration. Confirm RoHS compliance status and moisture sensitivity level for assembly processes.

Memory IC Selection Notes

Select this component when a parallel x8 interface and SLC endurance are required. Consider the 48-pin TSOP package constraints and board space availability. Evaluate the need for two-plane or interleaved operations to meet performance targets. Verify that the host controller supports the standard NAND command set and cache modes.

Memory IC Part Context

This part belongs to the Micron MT29FxG series of single-supply NAND flash memories. The series offers densities ranging from 4Gb to 16Gb with varying die configurations. The BAA designation indicates a dual-die stack configuration with common I/O, providing enhanced capacity within the same footprint.

Memory IC Replacement Considerations

Check for direct substitutes within the MT29F8G08 family with different suffixes for package or temperature variations. Verify pinout and command set compatibility with existing designs before swapping components.