MT41J256M4HX-15E:D TR

Memory IC Overview

Micron MT41J256M4HX-15E:D TR is a 1Gb DDR3 SDRAM with a 32 Meg x 4 organization and eight internal banks. It operates at VDD = VDDQ = +1.5V ±0.075V using a 78-ball FBGA (9mm x 11.5mm) package marked HX. The -15E speed grade supports a 1333 MT/s data rate with a target tRCD-tRP-CL of 9-9-9. Key features include an 8n-bit prefetch architecture, differential clock inputs, nominal and dynamic on-die termination, fixed burst length of 8, selectable burst chop of 4, write leveling, and self-refresh modes.

Memory IC Feature Summary

• Supports differential bidirectional data strobes and differential clock inputs for signal integrity.
• Features nominal and dynamic on-die termination for data, strobe, and mask signals.
• Includes write leveling capability to optimize timing in high-speed designs.
• Provides selectable burst chop or fixed burst length operations via mode register set.

Memory IC Applications

• High-bandwidth memory systems requiring 1.5V operation
• Graphics and display controllers utilizing parallel DRAM interfaces
• Embedded computing platforms needing compact 78-ball FBGA packaging

Memory IC Procurement Notes

Verify the specific ordering suffix against official Micron documentation to confirm package dimensions and marking codes. Ensure the selected speed grade matches the system's required clock frequency and latency constraints. Confirm RoHS compliance status through current manufacturer declarations before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a 1.5V DDR3 interface with a 4-bit width is required. The 78-ball FBGA package offers a compact footprint suitable for space-constrained applications. Verify that the system design supports the necessary initialization sequences and mode register configurations for optimal performance.

Memory IC Part Context

The MT41J256M4 belongs to Micron's 1Gb DDR3 SDRAM family, which also includes 128 Meg x 8 and 64 Meg x 16 variants. These components share common architectural features such as the 8n-bit prefetch and eight internal banks. The family utilizes various FBGA packages to accommodate different pin counts and form factors while maintaining standard DDR3 electrical specifications.

Memory IC Replacement Considerations

Cross-reference with other Micron 1Gb DDR3 parts like MT41J128M8 or MT41J64M16 if pin compatibility allows. Verify that alternative components match the required voltage, speed grade, and package dimensions. Consult official substitution guides to ensure functional equivalence in the target application.